TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat

Product Specification

TIF800QE High Thermal Conductivity Gray Silicone Thermal Pad For Electronic Heat Dissipation

Product descriptions

The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It ofers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity,enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink.This significantly improves the heat dissipation eficiency of electronic lcomponents, thereby enhancing operational stability and extending device lifespan.

Features

> Good thermal conductive:13.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available

Application

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers
> Medical Devices
> Auditioning electronic products
> unmanned aerial vehicle(UAV)

Product Specifications
Standard Thickness: 0.02 to 0.20 (0.50 to 5.0mm) with increments of 0.01 (0.25mm).
Standard Size: 16" X 16" (406mm X 406mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options:NS1 (Non-adhesive treatment),DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes:FG(Fiberglas)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.5mm).
TheTIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Vietnam Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Our services

Online-service : 12 hours , Inquiry reply within fastest.

Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.