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Tailored for semiconductor manufacturing workflows, this precision cleaning system integrates multi-stage ultrasonic processes to achieve ultra-high surface purity of silicon wafers, critical for ensuring device yield and performance in IC fabrication and MEMS processing.
Core Cleaning Stages:
Ultrasonic Alkaline Cleaning: Utilizes cavitation effect at adjustable frequencies to dissolve organic residues, photoresist remnants, and particulate contaminants from wafer surfaces and microstructures, preparing substrates for subsequent acid treatment.
Ultrasonic Acid Cleaning: Targets inorganic impurities (e.g., metal ions, oxide layers) via frequency-optimized ultrasonic energy, enhancing chemical reactivity to dislodge submicron contaminants embedded in patterned structures or wafer edges.
DI Water Rinsing: Implements high-purity deionized water circulation to eliminate residual chemicals, ensuring surface neutrality and meeting strict conductivity standards (≤18.2MΩ·cm) required for advanced semiconductor processing.
Technical Parameters:
Ultrasonic Frequency Range: 40KHz-80KHz (multi-band adjustable, enabling precise matching to contamination types and wafer geometries)
Process Temperature: 60℃ (thermostatically controlled to optimize chemical reaction rates while preventing wafer damage)
Material Compatibility: Constructed with PFA-lined tanks and quartz components to resist corrosive chemistries, avoiding secondary contamination.
Key Advantages:
Achieves sub-50nm particle removal efficiency, compliant with SEMI F020 standards
Frequency-tunable ultrasonic modules adapt to bare wafers, patterned wafers, and thin films
Integrated temperature control ensures consistent cleaning efficacy across batch processing
Seamless integration with upstream wafer handling systems and downstream lithography/etching processes
Application: Ideal for pre-diffusion, pre-deposition, and post-etch cleaning in 4-inch to 12-inch silicon wafer manufacturing lines.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, DI water rinsing, 40-80KHz, 60℃ process, silicon wafer surface treatment
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2005
Total Annual:
4,397,596.73-6,397,596.73
Employee Number:
460~500
Ecer Certification：
Verified Supplier
Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t... Jietai Ultrasonic was founded in 2005 and specializes in environmental ultrasonic cleaning equipment, wastewater purification equipment, surface treatment equipment, and supporting systems. As a high-tech enterprise integrating R&D, production, sales, and engineering services, we are committed t...
