Dongguan Ziitek Electronical Material and Technology Ltd.
| Payment Terms | T/T |
| Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days |
| Packaging Details | 24*13*12cm cartons |
| Products name | Heat Dissipation Thermal Pads High Conductivity Thermal Pad For GPU |
| Keywords | Thermal Pad |
| Hardness | 55 Shore 00 |
| Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
| Color | Gray |
| Flam rating | 94 V-0 |
| Features | Soft and compressible for low stress applications |
| Application | SSD CPU GPU Graphics Card Cooling |
| Thermal Conductivity | 12.0W/mK |
| Brand Name | Ziitek |
| Model Number | TIF100-12055-62 |
| Certification | UL & RoHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
| Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
| Products name | Heat Dissipation Thermal Pads High Conductivity Thermal Pad For GPU | Keywords | Thermal Pad |
| Hardness | 55 Shore 00 | Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
| Color | Gray | Flam rating | 94 V-0 |
| Features | Soft and compressible for low stress applications | Application | SSD CPU GPU Graphics Card Cooling |
| Thermal Conductivity | 12.0W/mK | Brand Name | Ziitek |
| Model Number | TIF100-12055-62 | Certification | UL & RoHS |
| Place of Origin | China | ||
| High Light | High Conductivity Thermal Pad ，Low Stress GPU Thermal Pad ，Soft Thermal Pad | ||
Heat Dissipation Thermal Pads High Conductivity Thermal Pad For GPU
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TIF®100 12055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 12.0W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> Cooling components to the chassis of frame
> High speed mass storage drives
> Handheld portable electronics
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIF®100 12055-62 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.3g/cc | ASTM D792 |
| thickness | 0.020"(0.5mm)~0.200"(5.00mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 55 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
| Dielectric Constant | 6.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL94(E331100) |
| Thermal conductivity | 12.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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