Dongguan Ziitek Electronic Materials & Technology Ltd.
| Supply Ability | 10000/day |
| Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag |
| Products name | Custom Thermal Pad GPU For Heat Dissipation In Telecom Automotive And Battery Systems Reliable Thermal Conductive Pad |
| Color | Gray |
| Continuos Use Temp | -45℃ to 200℃ |
| Hardness | 30 Shore 00 |
| Thermal conductivity& Compostion | 3.0W/m-K |
| Construction | Ceramic filled silicone elastomer |
| Specific Gravity | 3.1g/cc |
| Thickness | 0.012"~0.20"(0.30mm~5.0mm) |
| Keywords | Thermal Conductive Pad |
| Brand Name | ZIITEK |
| Model Number | TS-TIF 100C 3030-11 |
| Certification | UL and RoHs |
| Place of Origin | China |
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Product Specification
| Supply Ability | 10000/day | Delivery Time | 3-5work days |
| Packaging Details | 1000pcs/bag | Products name | Custom Thermal Pad GPU For Heat Dissipation In Telecom Automotive And Battery Systems Reliable Thermal Conductive Pad |
| Color | Gray | Continuos Use Temp | -45℃ to 200℃ |
| Hardness | 30 Shore 00 | Thermal conductivity& Compostion | 3.0W/m-K |
| Construction | Ceramic filled silicone elastomer | Specific Gravity | 3.1g/cc |
| Thickness | 0.012"~0.20"(0.30mm~5.0mm) | Keywords | Thermal Conductive Pad |
| Brand Name | ZIITEK | Model Number | TS-TIF 100C 3030-11 |
| Certification | UL and RoHs | Place of Origin | China |
| High Light | Battery Systems Thermal Conductive Pad ，Automotive Thermal Conductive Pad ，Custom Heat Dissipation Thermal Conductive Pad | ||
Custom Thermal Pad GPU For Heat Dissipation In Telecom Automotive And Battery Systems Reliable Thermal Conductive Pad
The TS-TIF ®100C 3030-11 Series is a silicone-based thermal material designed to fill the gapsbetween heat-generating components and liquid cooling plates or metal bases. lts flexibility andelasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, itefficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metalheat dissipation structures,thereby improving the cooling efficiency of high-power electroniccomponents and extending the lifespan of the equipment.
Features:
> Good thermal conductive:3.0W/MK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Available in varies thicknesses
> UL recognized
> Easy release construction
> Electrically isolating
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
| Typical Properties of TS-TIF ®100C 3030-11 Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Specific Gravity | 3.1g/cc | ASTM D297 |
| thickness | 0.012"~0.20"(0.30mm~5.0mm) | ASTM D374 |
| Hardness (thickness＜1.0mm) | 30 (Shore 00) | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
100000-160000
Employee Number:
100~150
Ecer Certification：
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S...
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