Hing Technology Co. Ltd
Products
Manufacturer of a wide range of products which include Reliable Substrate-like-PCB (SLP) High frequency, and low loss material pcb,Reliable Substrate-like-PCB (SLP) products anylayer up to 14 layer Embedded Capacity,Thickness 0.1m...
MOQ: 50
Price:
| Delivery Time | 30-40 days |
| working Temp. | -40~+85 |
| Payment Terms | T/T,L/C,D/P,D/A,Western Union |
| Product Name | Substrate Like PCBs |
| Supply Ability | 500000pcs/month |
| Packaging Details | 1set/box |
| Certification | CE ROHS |
| Place of Origin | CN |
| Brand Name | Hing |
MOQ: 50
Price:
| Delivery Time | 30-40 days |
| working Temp. | -40~+85 |
| Payment Terms | T/T,L/C,D/P,D/A,Western Union |
| Supply Ability | 500000pcs/month |
| Packaging Details | 1set/box |
| Product Name | Substrate Like PCBs |
| Certification | CE ROHS |
| Place of Origin | CN |
| Brand Name | Hing |
MOQ:
Price:
| Dielectricconstant | 3.5 - 4.5 |
| Productname | SLP Substrate Like PCB |
| Surfacefinish | ENIG / OSP / HASL |
| Copperfoilthickness | 18μm - 35μm |
| Coefficientofthermalexpansion | 10 - 15 Ppm/°C |
| Glasstransitiontemperature | 180°C - 220°C |
| Place Of Origin | China |
| Flexibility | High |
| Electricalinsulationresistance | >10^12 Ohms |
| Brand Name | Hing |
| Model Number | H-SSL |
MOQ: 50
Price:
| Delivery Time | 30-40 days |
| working Temp. | -40~+85 |
| Payment Terms | T/T,L/C,D/P,D/A,Western Union |
| Product Name | Substrate Like PCBs |
| Supply Ability | 500000pcs/month |
| Packaging Details | 1set/box |
| Certification | CE ROHS |
| Place of Origin | CN |
| Brand Name | Hing |
MOQ:
Price:
| Operatingtemperaturerange | -40°C To 125°C |
| Materialtype | Substrate-like PCB Material |
| Place Of Origin | China |
| Electricalinsulationresistance | >10^12 Ohms |
| Glasstransitiontemperature | 180°C - 220°C |
| Thermalconductivity | 0.8 - 1.2 W/mK |
| Productname | SLP Substrate Like PCB |
| Solderability | Excellent |
| Moistureabsorption | <0.1% |
| Model Number | H-SSL |
| Brand Name | Hing |
MOQ:
Price:
| Coefficientofthermalexpansion | 10 - 15 Ppm/°C |
| Copperfoilthickness | 18μm - 35μm |
| Thermalconductivity | 0.8 - 1.2 W/mK |
| Productname | SLP Substrate Like PCB |
| Flexibility | High |
| Thickness | 0.1mm - 0.3mm |
| Place Of Origin | China |
| Electricalinsulationresistance | >10^12 Ohms |
| Solderability | Excellent |
| Model Number | H-SSL |
| Brand Name | Hing |
MOQ: 50
Price:
| Delivery Time | 30-40 days |
| Supply Ability | 500000pcs/month |
| Packaging Details | 1set/box |
| Product Name | Substrate Like PCBs |
| working Temp. | -40~+85 |
| Payment Terms | T/T,L/C,D/P,D/A,Western Union |
| Brand Name | Hing |
| Certification | CE ROHS |
| Place of Origin | CN |
MOQ:
Price:
| Surfacefinish | ENIG / OSP / HASL |
| Working Temp | -40~+85 |
| Glasstransitiontemperature | 180°C - 220°C |
| Thickness | 0.1mm - 0.3mm |
| Coefficientofthermalexpansion | 10 - 15 Ppm/°C |
| Electricalinsulationresistance | >10^12 Ohms |
| Place Of Origin | China |
| Solderability | Excellent |
| Dielectricconstant | 3.5 - 4.5 |
| Brand Name | Hing |
| Model Number | H-SSL |
MOQ:
Price:
| Glasstransitiontemperature | 180°C - 220°C |
| Electricalinsulationresistance | >10^12 Ohms |
| Place Of Origin | China |
| Flexibility | High |
| Productname | SLP Substrate Like PCB |
| Materialtype | Substrate-like PCB Material |
| Thermalconductivity | 0.8 - 1.2 W/mK |
| Thickness | 0.1mm - 0.3mm |
| Moistureabsorption | <0.1% |
| Brand Name | Hing |
| Model Number | H-SSL |
MOQ:
Price:
| Dielectricconstant | 3.5 - 4.5 |
| Working Temp | -40~+85 |
| Place Of Origin | China |
| Coefficientofthermalexpansion | 10 - 15 Ppm/°C |
| Flexibility | High |
| Glasstransitiontemperature | 180°C - 220°C |
| Solderability | Excellent |
| Thickness | 0.1mm - 0.3mm |
| Copperfoilthickness | 18μm - 35μm |
| Brand Name | Hing |
| Model Number | H-SSL |
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