OEM SMT PCB assembly shenzhen SMT DIP PCB Assembly Manufacturer pcb factory

Product Specification

OEM SMT PCB assembly shenzhen SMT DIP PCB Assembly Manufacturer pcb factory ISO9001

1. Features

1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available

2. Specifications

Material: Shengyi FR4
Finish Board Thickness: 1.6MM
Finsh Copper Thickness: 1OZ
Layer 2
Solder Mask Color: GREEN
Silkscreen: WHITE
Surface Treatment: HASL LF

Finished Size CUSTOMIZED

3.Manufacturer Capacity:

    SMT PCB assembly refers to the process of manufacturing a printed circuit board (PCB) using surface mount technology, where electronic components are placed and soldered directly to the PCB surface rather than inserted through holes.

Key aspects of SMT PCB assembly include:

Component placement:
    SMT components such as resistors, capacitors, integrated circuits (ICs) and other surface mount devices are placed directly on the PCB surface using automated pick and place machines.
    Precise component placement is critical to ensure accurate alignment and reliable electrical connections.

Solder paste deposition:
    Solder paste is a mixture of solder alloy particles and flux that is selectively deposited on the copper pads of a PCB using stencil printing or other automated processes.
    Solder paste acts as an adhesive and conductive material that will form the electrical connection between the components and the PCB.

Reflow soldering:
    After the components are placed, the PCB assembly goes through a reflow soldering process that heats the board in a controlled environment to melt the solder paste and form electrical and mechanical connections between the components and the PCB.
    Reflow profiles including temperature, time and atmosphere are carefully optimized to ensure reliable solder joints.

Automatically detect:
    After the reflow process, PCB assemblies are automatically inspected using a variety of techniques, such as optical inspection, X-ray inspection, or automated optical inspection (AOI).
    These inspections help identify and correct any problems such as soldering defects, component misalignment or missing components.

Testing & Quality Control:
    Comprehensive testing, including functional, electrical, and environmental testing, is performed to ensure that PCB assemblies meet required specifications and performance standards.
    Implements quality control measures, such as statistical process control and failure analysis, to maintain high manufacturing standards and product reliability.

The advantages of SMT PCB assembly:

    Higher Component Density: SMT components are smaller and can be placed closer together, resulting in a more compact, smaller PCB design.

    Improved reliability: SMT solder joints are more resistant to vibration, shock and thermal cycling than through-hole connections.

    Automated manufacturing: The SMT assembly process can be highly automated, increasing production efficiency and reducing manual labor.

    Cost-Effectiveness: SMT assembly can be more cost-effective, especially for high-volume production, due to reduced material and labor costs.

SMT PCB assembly applications:

    Consumer Electronics: Smartphones, Tablets, Laptops, and Other Portable Devices

    Industrial electronics: control systems, automation equipment and power electronics equipment

    Automotive electronics: engine control units, infotainment and safety systems

    Aerospace and defense: avionics, satellite systems and military equipment

    Medical devices: diagnostic equipment, implantable devices and portable healthcare solutions

    SMT PCB assembly is a foundational technology used to produce compact, reliable, and cost-effective electronic devices in a variety of industries.

Certifications:

    ISO9001 / ISO14001 / ISO45001 (Military) / TS16949 (Automotive) / RoHS / UL

4. Pictures