Shenzhen Leadsintec Technology Co., Ltd
| Payment Terms | L/C, T/T, D/A, D/P, Western Union |
| Supply Ability | 80000pcs/month |
| Delivery Time | 1-30days |
| Packaging Details | PCB: Vacuum Packing / PCBA: ESD Packing |
| Product name | Automotive PCB Assembly |
| Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Base material | FR-4 |
| Surface finishing | HASL/OSP/ENIG |
| Solder mask color | White Black Yellow Green Red |
| Layers | 1-58layers |
| Item | ODM OEM LED PCBA |
| Pcb test | Flying probe and AOI (Default)/Fixture Test |
| Pcb assembly method | Through-hole |
| Brand Name | Leadsintec |
| Model Number | PCBA |
| Certification | IATF16949, ISO13485, ISO9001 |
| Place of Origin | Shenzhen |
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Product Specification
| Payment Terms | L/C, T/T, D/A, D/P, Western Union | Supply Ability | 80000pcs/month |
| Delivery Time | 1-30days | Packaging Details | PCB: Vacuum Packing / PCBA: ESD Packing |
| Product name | Automotive PCB Assembly | Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| Base material | FR-4 | Surface finishing | HASL/OSP/ENIG |
| Solder mask color | White Black Yellow Green Red | Layers | 1-58layers |
| Item | ODM OEM LED PCBA | Pcb test | Flying probe and AOI (Default)/Fixture Test |
| Pcb assembly method | Through-hole | Brand Name | Leadsintec |
| Model Number | PCBA | Certification | IATF16949, ISO13485, ISO9001 |
| Place of Origin | Shenzhen | ||
| High Light | 8mil Automotive PCB Assembly ，IATF Automotive PCB Assembly ，8mil printed board assembly | ||
2 Layer Solder Automotive PCB Assembly Mask 8mil Flexible Printed
Automotive PCB Assembly Contract Manufacturing 2 Layer Solder Mask Electronic PCBA
What Can LeadsintecDo?
Leadsintec is a professional PCB / PCBA Manufacturer in China, Shenzhen. With 20 years of development, FASPCBA turns into a first-class manufacturer of PCB / PCBA. From multi-layered to flexible printed circuit boards, Leadsintec is your one-stop-shop. We provide our customers with PCB Manufacturing, PCB Assembly, and Parts Sourcing services to save your time & cost.
Flex PCB Capability :
| Items | Type | Normal Manufacturing Capability |
| Standard Deliverable | Inspection Std. | IPC-6013 Class2, IPC-A-600G Class2 |
| Test Std. | IPC-TM-650,GB/T4677-2002 | |
| Material | DuPont | AL9111R, AP9121R, AP9131R, AP8525R |
| Panasonic | R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M | |
| Taiflex | NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THK D200520JY | |
| Process capacity | Layers | 0-14 |
| Thickness | 0.07-4.0mm | |
| Max dimension | 10X18 Inch | |
| Min precision Of Dim | ±4mil | |
| Min diameter of holes | 4mil (Laser drill); 8mil(mechanical drill) | |
| Aspect ratio | 10:1 | |
| Min trace width/sp ce outer layer(0.5OZ ) | 3.0/3.0mil | |
| Min trace width/space outer layer(1OZ ) | 3.5/3.5mil | |
| Min trace width/space outer layer(2OZ ) | 5/5mil | |
| Min trace width/space inner layer(0.5OZ ) | 3.5/3.5mil | |
| Min trace width/space inner layer(1OZ ) | 4/4mil | |
| Min trace width/space wtidth of gridding circr | 5/5mil | |
| Min trace width/space wtidth of out layer | 5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)； 8/5.5mil(2oz copper)； | |
| Min distance Between drilling&conductor(via holes) | 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers) | |
| Min distance Between drilling&conductor(compon ent holes) | 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers) |
| Min distance Between drilling&conductor(buried &blind holes) | 7mil | |
| Min ring of inner layer(via holes) | 5mil(≤6 Layers) ；8mil(＞8Layers) | |
| Min ring of inner layer(component holes) | 8mil(≤6Layers) ；11mil(＞8Layers) | |
| The vias to the coalescent location of rigid and flex | 1mm | |
| HDI board | 1+n+1 | |
| Surface treatment | Plating Gold(Hard gold) | Normal:0.25-0.76um;Hard gold:0.76-2um； |
| ENIG | Ni:3--8um,Au:0.05-0.1um | |
| Immersion Tin | 0.80-1.20um | |
| Immersion Silver | 0.10-0.30um | |
| 0SP | 0.15-0.30um | |
| HASL | 2-40um | |
| HASL lead free | 2-40um | |
| Silver ink | 10-25um | |
| Selective surface finishing | ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG. | |
| Min. bended radius | single side flex | 3-6 times the flex thickness |
| double sides flex | 6-10 times the flex thickness | |
| multi-layers flex | 10-15 times the flex thickness | |
| dynamic bending | 20-40 times the flex thickness |
Rigid-Flex PCB Capability :
| Items | Type | Normal Manufacturing Capability |
| Standard | Inspection Std. | IPC-6013 Class 2, IPC-A-600G Class 2, IPC-6013 Class 3 |
| Test Std. | IPC-TM-650,GB/T4677-2002 | |
| Material | DuPont | AL9111R, AP9121R, AP9131R, AP8525R |
| Panasonic | R-F775 11RB-M, R-F775 22RB-M, R-F775 21RB-M | |
| Taiflex | NDIR050513HJY,IDIR051013HJY,NDIR100520HJY,THKD200520 | |
| No Flow PP | VT-47N,VT-901 | |
| CCL | ITEQ IT180A , ShengYi 1000-2,N4000-13, Rogers4350B,4003C | |
| Process capacity | Layers | 2-20 |
| Thickness | 8-118mil | |
| Max dimension | 15.74X28 Inch | |
| Min precision Of Dim | ±4mil | |
| Min diameter of holes | 4mil (Laser drill); 6mil(mechanical drill) | |
| Aspect ratio | 16:1 | |
| Min trace width/space wtidth of outer |
3.0/3.0mil | |
| Min trace width/space wtidth of outer |
3.5/3.5mil | |
| wtidth of outer layer(2OZ finished | 5/5mil | |
| Min trace width/space wtidth of inner | 3.5/3.5mil | |
| Min trace width/space wtidth of out layer(1OZ | 4/4mil | |
| Min trace width/space wtidth of gridding circr | 5/5mil | |
| Min trace width/space wtidth of out layer(2OZ finishedcopper,Flex layer on top or bottom) | 5/5mil(1/3,1/2oz copper)；6.5/5mil(1oz copper)；8/5.5mil (2oz copper)； | |
| Min distance Between drilling&conductor(via holes) | 7mil(2layers);9mil(3~6Llayers);11mil(≥7layers) | |
| Min distance Between drilling&conductor(com ponent holes) | 10mil(2layers);12mil(3~6Llayers);14mil(≥7layers) | |
| Min distance Between drilling&conductor(burie d &blind holes) | 7mil | |
| Min ring of inner layer(via holes) | 5mil(≤6 Layers) ；8mil(＞8Layers) |
|
Min ring of inner layer(component holes) | 8mil(≤6Layers) ；11mil(＞8Layers) | |
|
coalescent location of rigid and flex | 1mm | |
| HDI board | 1+n+1 | |
| Surface treatmen t | Plating Gold(Hard gold) | Normal:0.25-0.76um;Hard gold:0.76-2um； |
| ENIG | Ni:3--8um,Au:0.05-0.1um | |
| Immersion Tin | 0.80-1.20um | |
| Immersion Silver | 0.10-0.30um | |
| 0SP | 0.15-0.30um | |
| HASL | 2-40um | |
| HASL lead free | 2-40um | |
| Silver ink | 10-25um | |
| Selective surface finishing | ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG. | |
| Routing | Outline Tol. | +/-4mil |
Leadsintec has been selected as the “excellent partner of the year” by numerous well-known enterprises, and won many domestic and authorized certifications at home and abroad, such as Chinese high-tech project certification, ISO9001, ISO14001, ISO13485, IATF16949 quality management system standard, and customized CE, UL, FCC, and other product certifications according to the customer's requirements.
100% PCB PCBA Testing:
Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, military, aviation & aerospace, intelligent home, and other industries around the world. We will continue to improve our quality and service; customer satisfaction and the development of science and technology are our eternal motivation.
Company Details
Business Type:
Manufacturer
Year Established:
2004
Total Annual:
10,000,000-100,000,000
Employee Number:
100~300
Ecer Certification：
Active Member
Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services. Owi... Leadsintec Co., Ltd is an electronics manufacturing service (EMS) provider located in Shenzhen China since 2004. As an ISO 9001 certified electronics contract manufacturer, we offer a full range of PCB, component procurement, PCB assembly, box-build, testing, cables, and accessories services. Owi...
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