soldering void measurement x ray machine

{"cid":"91183560","title":"SMT BGA Soldering Void Measurement X-Ray Machine Microfocus 130kV","imgUrl":"https:\/\/img.ismap.com\/nimg\/05\/d6\/231d2b41341e8232fdb97604d2a3-200x200-1.jpg","attrs":{"Price":"can negotiate","Brand Name":"UNICOMP","Model Number":"AX9100","Minimum Order Quantity":"1Set","Delivery Time":"30 days","Certification":"CE, FDA","Place of Origin":"China","Payment Terms":"T\/T, L\/C","Supply Ability":"300 sets per month","Packaging Details":"Wooden Case, Waterproof, Anti-collision","Name":"X-ray Inspection Machine","Application":"SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor","Tube Voltage":"130KV","Industry":"Electronics Industry","Size":"1350(L)x1250(W)x1700(H)mm","X-ray Leakage":"< 1uSv\/h","Weight":"1900kg","Power Consumption":"1.6kW"}}

{"cid":"91208914","title":"5uM Microfocus X Ray PCB Inspection Machine With FPD 55 Degree Tilting View BGA Soldering Void","imgUrl":"https:\/\/img.ismap.com\/nimg\/ff\/1a\/51fe0feb0f2da17178ef8ea47e3e-200x200-1.jpg","attrs":{"Price":"Negotiate","Minimum Order Quantity":"1unit","Delivery Time":"5-7 working days","Payment Terms":"L\/C, D\/A, T\/T, Western Union, MoneyGram","Supply Ability":"200 units\/month","Packaging Details":"wooden package","Tube Voltage":"0~90kV (Adjustable)","Tube Type":"Sealed","Focus Spot Size":"5\u03bcm","Detector":"Flat Panel Detector","Packing Weight":"1300 Kg","Power Supply":"AC 110~220V, 50\/60Hz"}}

{"cid":"91222395","title":"High Speed Automated X-Ray CT Inspection System","imgUrl":"https:\/\/img.ismap.com\/nimg\/49\/25\/89869a98d0b6eba49cf02fdf5359-200x200-1.jpg","attrs":{"Price":"USD+negotiable+pcs","Brand Name":"OMRON","Model Number":"VT-X750","Minimum Order Quantity":"1 PCS","Delivery Time":"1-7 days","Place of Origin":"Japan","Payment Terms":"T\/T","Supply Ability":"1+pcs+per days","Packaging Details":"1650*2100*1700mm","Model":"VT-X750","Inspection object":"BGA\/CSP, inserted components, SOP, QFP, transistors, R\/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc","Inspection items":"Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)","Imaging system Method":"3D-slice imaging by using parallel CT","Imaging system X-ray source":"Micro-fucus closed tube","Imaging system X-ray detector":"Flat panel detector","PCBA Size":"50x50\uff5e610x515mm (2x2 to 24x20 inch), Thickness\uff1a0.4\uff5e5.0mm (0.4\uff5e3.0mm in 3\u03bcm resolution)","PCBA Weight":"Less than 4.0 kg, less than 8.0 kg (*option)","PCBA Component clearance *Maximum":"Top: 90 mm (*option), Bottom: 40 mm","PCBA Warpage":"Less than 2.0 mm (Less than 1.0 \uff4d\uff4d in 3\u03bcm resolution)","Main body Footprint":"1,550(W) x 1,925(D) x 1,645(H) mm","Main body Weight":"Approx. 3,100kg"}}