40mm 0 2mm wafer dicing blade

{"cid":"91200053","title":"Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade","imgUrl":"https:\/\/img.ismap.com\/nimg\/4c\/71\/0419e5c38c0875544e764cca412d-200x200-1.jpg","attrs":{"Price":"Usd30-50 Per Piece Fob","Brand Name":"TONGYU INDUSTY","Model Number":"RTR1A8-006","Minimum Order Quantity":"5pcs","Delivery Time":"7-20days","Place of Origin":"CHINA","Payment Terms":"T\/T, L\/C, D\/P, Western Union","Supply Ability":"10,000pcs per Month","Packaging Details":"Plastic Inner box + Carton box outer side","Shape":"Super Thin Diamond Dicing, Round","Grinding Material":"Superior Diamond Grits","Type":"Integral Blade","Out Diameter":"40-120mm","Inner Diameter":"20 or 40mm","Thickness":"0.1-1mm","Grit Size":"120-1500","Processing Object":"Semiconductor, Optical Glass, Ceramics, Magnetic Material etc. etc","Bonded Type":"Resin Bonded"}}