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China Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave
China Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave

  1. China Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave

Rogers RT/duroid 5880 PCB Board for Ultra-High-Frequency and Millimeter-Wave

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Base material Rogers RT/duroid 5880
Layer count Double sided
PCB thickness 1.1mm
PCB size 110mm × 33.59mm ±0.15mm
Copper weight 1oz (35μm) for outer layers
Surface finish Immersion Gold
Brand Name Bicheng
Model Number BIC-052.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Base material Rogers RT/duroid 5880 Layer count Double sided
PCB thickness 1.1mm PCB size 110mm × 33.59mm ±0.15mm
Copper weight 1oz (35μm) for outer layers Surface finish Immersion Gold
Brand Name Bicheng Model Number BIC-052.V1.0
Certification UL, ISO9001, IATF16949 Place of Origin CHINA
High Light Ultra-High-Frequency Rogers PCB BoardMillimeter-Wave RF PCBLow Loss High Frequency PCB

This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880—a PTFE composite reinforced with glass microfibers—engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material’s exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.

 

PCB Specifications

Parameter Technical Details Engineering Significance
Base Material Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance
Layer Count 2-layer rigid configuration Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk
Board Dimensions 110mm × 33.59mm ±0.15mm Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules)
Minimum Trace/Space 4/6 mils Supports high-density routing of RF signals with controlled impedance and minimal signal coupling
Minimum Hole Size 0.3mm Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity
Finished Board Thickness 1.1mm Balances structural rigidity for handling with thin-profile requirements for compact RF designs
Finished Copper Weight 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) Ensures low conductor resistance while minimizing skin-effect losses at high frequencies
Surface Finish Immersion Gold Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components
Silkscreen White on top layer; no silkscreen on bottom layer Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer
Solder Mask No solder mask on top or bottom layers Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation
Quality Assurance 100% electrical testing (continuity, isolation, and impedance verification) Confirms compliance with design specs, preventing signal loss or short circuits in field deployment

 

Stack-up Configuration

The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:

Layer Sequence Material/Component Thickness Function
1 Copper Layer 1 (Top) 35μm Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths)
2 RT/duroid 5880 Substrate 1.016mm (40mil) Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching
3 Copper Layer 2 (Bottom) 35μm Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding

 

RT/duroid 5880 Key Features

Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:

 

Precise Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10GHz/23°C, ensuring minimal impedance variation across the PCB and consistent signal propagation.

 

Ultra-Low Dissipation Factor: 0.0009 at 10GHz, minimizing signal attenuation even in Ku-band and millimeter-wave (>30GHz) applications.

 

Stable Temperature Coefficient of Dk: TCDk of -125 ppm/°C, maintaining dielectric performance across typical RF operating temperatures (-40°C to +85°C).

 

Minimal Moisture Absorption: 0.02% by weight, preventing dielectric constant drift and material degradation in high-humidity environments.

 

Isotropic Thermal Expansion: CTE of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring dimensional stability and reducing trace warpage during thermal cycling.

 

Isotropic Material Structure: Uniform performance in all in-plane directions, critical for symmetric RF designs like microstrip patch antennas.

 

 

RT/duroid 5880 Material Benefits

The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:

 

Uniform Electrical Performance Over Wide Frequencies: Tight Dk tolerance and low Df enable consistent signal integrity from UHF to millimeter waves, eliminating the need for design adjustments across frequency bands.

 

Easy Machinability: Can be cut, sheared, and drilled using standard PCB equipment—unlike other PTFE-based materials that require specialized tools—reducing manufacturing complexity and lead times.

 

Chemical Resistance: Withstands solvents and reagents used in etching, plating, and cleaning processes (both hot and cold), ensuring no material degradation during fabrication.

 

High Reliability in Moist Environments: Low moisture absorption (0.02%) makes it ideal for applications like commercial airline broadband antennas, which operate in humid cabin conditions.

 

Well-Established Industrial Compatibility: A mature material with proven performance in RF/microwave systems, ensuring compatibility with standard component libraries and manufacturing workflows.

 

Lowest Electrical Loss Among Reinforced PTFE Materials: Outperforms other glass-reinforced PTFE laminates in loss reduction, maximizing power efficiency in high-frequency circuits like radar transmitters and power amplifiers.

 

Manufacturing and Quality Standards

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines).

 

Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial RF applications (e.g., point-to-point digital radios, satellite LNBs) with strict quality controls for trace width, hole accuracy, and electrical continuity.

 

Processing Efficiency: RT/duroid 5880’s compatibility with FR-4-like processing (no special through-hole treatments) reduces fabrication costs compared to specialized microwave laminates.

 

Some Typical Applications:

- Commercial Airline Broadband Antennas

- Microstrip and Stripline Circuits

- Millimeter Wave Applications

- Radar Systems

- Guidance Systems

- Point to Point Digital Radio Antennas

 

Availability

This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment—from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).

 

Conclusion

This PCB combines Rogers’ high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880’s uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness—making it a optimal solution for demanding RF/microwave systems.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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