Payment Terms | T/T |
Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days |
Packaging Details | Vacuum bags+Cartons |
Base material | Rogers RT/duroid 5880 |
Layer count | Double sided |
PCB thickness | 1.1mm |
PCB size | 110mm × 33.59mm ±0.15mm |
Copper weight | 1oz (35μm) for outer layers |
Surface finish | Immersion Gold |
Brand Name | Bicheng |
Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 5000PCS per month |
Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
Base material | Rogers RT/duroid 5880 | Layer count | Double sided |
PCB thickness | 1.1mm | PCB size | 110mm × 33.59mm ±0.15mm |
Copper weight | 1oz (35μm) for outer layers | Surface finish | Immersion Gold |
Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
High Light | Ultra-High-Frequency Rogers PCB Board ,Millimeter-Wave RF PCB ,Low Loss High Frequency PCB |
This document details a high-performance 2-layer rigid printed circuit board (PCB) constructed with Rogers RT/duroid 5880—a PTFE composite reinforced with glass microfibers—engineered for ultra-high-frequency (UHF) to millimeter-wave applications. The PCB leverages the material’s exceptional dielectric uniformity and low loss to deliver reliable signal performance, paired with precision manufacturing to meet strict dimensional and electrical standards for RF/microwave systems.
PCB Specifications
Parameter | Technical Details | Engineering Significance |
Base Material | Rogers RT/duroid 5880 (PTFE composite reinforced with glass microfibers) | Enables ultra-low dielectric loss and uniform Dk, critical for millimeter-wave performance |
Layer Count | 2-layer rigid configuration | Simplifies high-frequency routing (microstrip/stripline) while minimizing interlayer crosstalk |
Board Dimensions | 110mm × 33.59mm ±0.15mm | Ensures precise fit for enclosure integration and automated assembly (e.g., antenna modules) |
Minimum Trace/Space | 4/6 mils | Supports high-density routing of RF signals with controlled impedance and minimal signal coupling |
Minimum Hole Size | 0.3mm | Accommodates fine-pitch thru-hole components (e.g., RF connectors) while maintaining structural integrity |
Finished Board Thickness | 1.1mm | Balances structural rigidity for handling with thin-profile requirements for compact RF designs |
Finished Copper Weight | 1oz (35μm) for outer layers (no inner layers in 2-layer stackup) | Ensures low conductor resistance while minimizing skin-effect losses at high frequencies |
Surface Finish | Immersion Gold | Delivers stable RF contact resistance, excellent corrosion resistance, and reliable solderability for SMT/thru-hole components |
Silkscreen | White on top layer; no silkscreen on bottom layer | Enables component identification without introducing dielectric discontinuities on the signal-critical bottom layer |
Solder Mask | No solder mask on top or bottom layers | Eliminates unwanted dielectric variations that could degrade high-frequency signal propagation |
Quality Assurance | 100% electrical testing (continuity, isolation, and impedance verification) | Confirms compliance with design specs, preventing signal loss or short circuits in field deployment |
Stack-up Configuration
The 2-layer stack-up is engineered for optimal microstrip performance and controlled impedance, with a simplified structure tailored to high-frequency applications:
Layer Sequence | Material/Component | Thickness | Function |
1 | Copper Layer 1 (Top) | 35μm | Primary signal layer for microstrip traces (e.g., antenna feed lines, RF paths) |
2 | RT/duroid 5880 Substrate | 1.016mm (40mil) | Core dielectric layer with tightly controlled Dk for 50Ω/75Ω impedance matching |
3 | Copper Layer 2 (Bottom) | 35μm | Ground plane for Layer 1 signals; minimizes EMI and enhances signal shielding |
RT/duroid 5880 Key Features
Building on its material properties, RT/duroid 5880 delivers targeted performance features critical for high-frequency PCB design:
Precise Dielectric Constant: 2.2 with a tight tolerance of ±0.02 at 10GHz/23°C, ensuring minimal impedance variation across the PCB and consistent signal propagation.
Ultra-Low Dissipation Factor: 0.0009 at 10GHz, minimizing signal attenuation even in Ku-band and millimeter-wave (>30GHz) applications.
Stable Temperature Coefficient of Dk: TCDk of -125 ppm/°C, maintaining dielectric performance across typical RF operating temperatures (-40°C to +85°C).
Minimal Moisture Absorption: 0.02% by weight, preventing dielectric constant drift and material degradation in high-humidity environments.
Isotropic Thermal Expansion: CTE of 31 ppm/°C (X-axis), 48 ppm/°C (Y-axis), and 237 ppm/°C (Z-axis), ensuring dimensional stability and reducing trace warpage during thermal cycling.
Isotropic Material Structure: Uniform performance in all in-plane directions, critical for symmetric RF designs like microstrip patch antennas.
RT/duroid 5880 Material Benefits
The features of RT/duroid 5880 translate to tangible advantages for PCB manufacturing, performance, and application suitability:
Uniform Electrical Performance Over Wide Frequencies: Tight Dk tolerance and low Df enable consistent signal integrity from UHF to millimeter waves, eliminating the need for design adjustments across frequency bands.
Easy Machinability: Can be cut, sheared, and drilled using standard PCB equipment—unlike other PTFE-based materials that require specialized tools—reducing manufacturing complexity and lead times.
Chemical Resistance: Withstands solvents and reagents used in etching, plating, and cleaning processes (both hot and cold), ensuring no material degradation during fabrication.
High Reliability in Moist Environments: Low moisture absorption (0.02%) makes it ideal for applications like commercial airline broadband antennas, which operate in humid cabin conditions.
Well-Established Industrial Compatibility: A mature material with proven performance in RF/microwave systems, ensuring compatibility with standard component libraries and manufacturing workflows.
Lowest Electrical Loss Among Reinforced PTFE Materials: Outperforms other glass-reinforced PTFE laminates in loss reduction, maximizing power efficiency in high-frequency circuits like radar transmitters and power amplifiers.
Manufacturing and Quality Standards
Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with all major manufacturing equipment (e.g., laser plotters, drilling machines).
Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial RF applications (e.g., point-to-point digital radios, satellite LNBs) with strict quality controls for trace width, hole accuracy, and electrical continuity.
Processing Efficiency: RT/duroid 5880’s compatibility with FR-4-like processing (no special through-hole treatments) reduces fabrication costs compared to specialized microwave laminates.
Some Typical Applications:
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point to Point Digital Radio Antennas
Availability
This PCB is available for worldwide shipping, supporting global project needs for RF/microwave equipment—from aerospace (e.g., aircraft antennas) to telecommunications (e.g., 5G base stations).
Conclusion
This PCB combines Rogers’ high-performance PTFE composite with precision manufacturing to address the demands of ultra-high-frequency applications. By integrating RT/duroid 5880’s uniform dielectric properties, low loss, and easy machinability, the PCB delivers exceptional signal integrity, reliability, and cost-effectiveness—making it a optimal solution for demanding RF/microwave systems.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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