Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Taconic TLX-9 |
| Layer count | 2-layer |
| PCB thickness | 1.35mm |
| PCB size | 57mm x 136mm (tolerance: ±0.15mm) |
| Copper weight | 1oz (1.4 mils) on outer layers |
| Surface finish | Immersion tin |
| Brand Name | Bicheng |
| Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Taconic TLX-9 | Layer count | 2-layer |
| PCB thickness | 1.35mm | PCB size | 57mm x 136mm (tolerance: ±0.15mm) |
| Copper weight | 1oz (1.4 mils) on outer layers | Surface finish | Immersion tin |
| Brand Name | Bicheng | Model Number | BIC-052.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Taconic TLX-9 RF PCB ，2-layer immersion tin PCB ，50mil Taconic PCB board | ||
This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical.
1. PCB Specifications
This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance:
| Parameter | Specification |
| Base Material | Taconic TLX-9 (PTFE/woven glass composite) |
| Layer Configuration | 2 outer layers (no blind vias) |
| Dimensions | 57mm x 136mm per unit (tolerance: ±0.15mm) |
| Trace/Space | Minimum 6/6 mils (ensuring signal integrity in dense layouts) |
| Minimum Hole Size | 0.3mm (supports compact component mounting) |
| Finished Thickness | 1.35mm (balanced rigidity and versatility) |
| Copper Weight | 1oz (1.4 mils) on outer layers (35μm per copper layer) |
| Via Plating | 20μm thickness (enhances conductivity and durability) |
| Surface Finish | Immersion tin (corrosion resistance and solderability) |
| Silkscreen & Solder Mask | White top silkscreen (for component identification); no bottom silkscreen or solder mask (optimized for specific mounting needs) |
| Quality Assurance | Printed series numbers for traceability + 100% electrical testing prior to shipment (eliminates defects in critical applications) |
2. PCB Stack-up
| Layer/Component | Specification |
| Copper Layer 1 | 35μm |
| Taconic TLX-9 Core | 1.27mm (50mil) |
| Copper Layer 2 | 35μm |
3. Artwork & Quality Standards
Artwork Format: Gerber RS-274-X (industry-standard format for PCB fabrication)
Quality Certification: IPC-Class-2 (meets rigorous acceptability criteria)
Global Availability: Supplied worldwide to support international project requirements
4. TLX-9 Material: Overview & Key Properties
Taconic TLX-9 is a PTFE/woven glass laminate engineered for precision electronics, offering exceptional processability (shearing, drilling, milling, plating) using standard PTFE fabrication methods. Its dimensional stability and near-zero moisture absorption (<0.02%) during manufacturing make it ideal for high-reliability applications. Below are its critical technical properties (measured at 10 GHz unless noted):
| Property | Specification |
| Dielectric Constant (DK) | 2.5 (tightly controlled across frequency/temperature) |
| Dissipation Factor (DF) | 0.0019 |
| Moisture Absorption | <0.02% |
| Dielectric Breakdown | >60 kV |
| Volume Resistivity | 10⁷ Mohm/cm |
| Surface Resistivity | 10⁷ Mohm |
| Arc Resistance | >180 seconds |
| Flexural Strength (Lengthwise) | >23,000 lbs./in. |
| Flexural Strength (Crosswise) | >19,000 lbs./in. |
| Peel Strength (1oz copper) | 12 lbs./linear in. |
| Thermal Conductivity | 0.19 W/m/K |
| x-y CTE | 9-12 ppm/°C |
| z CTE | 130-145 ppm/°C |
| UL-94 Flammability Rating | V-0 (flame-retardant) |
5. Core Benefits of TLX-9 PCB
This PCB leverages TLX-9’s inherent advantages to deliver superior performance:
Low Dielectric Constant (2.5): Minimizes signal loss and crosstalk in high-frequency applications.
Low Dissipation Factor (0.0019): Ensures efficient power transfer with minimal energy waste.
Near-Zero Moisture Absorption: Prevents performance degradation from environmental humidity.
High Dielectric Breakdown (>60 kV): Supports high-voltage operation without insulation failure.
Strong Peel Strength (12 lbs./linear in.): Enhances bond reliability between copper layers and substrate.
Controlled CTE: Matches thermal expansion of components (x-y CTE: 9-12 ppm/°C), reducing stress during temperature cycling.
6. Typical Applications
The combination of TLX-9’s properties and the PCB’s precision construction makes it ideal for:
-Low-Noise Amplifiers (LNAs), Low-Noise Blocks (LNBs), and Low-Noise Converters (LNCs)
-Personal Communications Service (PCS)/Personal Communications Network (PCN) systems
-Large Format Antennas
-High Power Amplifiers
-Passive Components (resistors, capacitors, inductors) for high-frequency circuits
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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