Double Sided RT Duroid 6035HTC PCB 10mil Immersion Silver Circuits

Product Specification

Introduction to RT/Duroid 6035HTC
Rogers RT/Duroid 6035HTC is a high-frequency circuit material that combines ceramic-filled PTFE composites, making it an exceptional choice for high-power RF and microwave applications. This laminate boasts thermal conductivity nearly 2.4 times that of standard RT/Duroid 6000 products, ensuring excellent long-term thermal stability when paired with copper foil (both ED and reverse-treated). Furthermore, Rogers’ advanced filler system enhances drillability, significantly reducing drilling costs compared to traditional high thermally conductive laminates that utilize alumina fillers.

Key Features
Dielectric Constant (DK): 3.5 ± 0.05 at 10 GHz/23°C.
Dissipation Factor: 0.0013 at 10 GHz/23°C.
Thermal Coefficient of Dielectric Constant: -66 ppm/°C.
Moisture Absorption: 0.06%.
Thermal Conductivity: 1.44 W/m/K at 80°C.
Coefficient of Thermal Expansion (CTE): 19 ppm/°C in both X and Y axes, 39 ppm/°C in the Z-axis.

These characteristics ensure that RT/Duroid 6035HTC PCB meets the rigorous demands of modern electronics, providing a stable platform for high-frequency applications.

Why Choose RT/Duroid 6035HTC?
 

Outstanding Thermal Management: The high thermal conductivity allows for superior heat dissipation, resulting in cooler operating temperatures for high-power applications. This translates to enhanced reliability and longevity for electronic components.
 

Impressive Dielectric Performance: With a low dissipation factor, RT/Duroid 6035HTC minimizes insertion loss, ensuring that signals remain strong and clear even at elevated frequencies.
 

Long-lasting Stability: The combination of excellent thermal and electrical properties guarantees that this PCB maintains its performance over time, even under demanding conditions.

PCB Construction details
This 2-layer rigid PCB featuring a specific stackup: Copper Layer 1 at 35 μm, an RT/Duroid 6035HTC core of 0.254 mm (10 mil), and Copper Layer 2 also at 35 μm. Detailed construction specifications include board dimensions of 54 mm x 76 mm (± 0.15 mm), a minimum trace/space of 4/4 mils, and a minimum hole size of 0.2 mm. The finished board thickness is 0.3 mm, with a finished copper weight of 1 oz (1.4 mils) for outer layers. The PCB is also rigorously tested, with 100% electrical testing conducted prior to shipment.

Artwork and Standards
This PCB is supplied with Gerber RS-274-X artwork and complies with IPC-Class-2 standards, ensuring high quality and reliability throughout the production process.

Global Availability
The RT/Duroid 6035HTC PCB is available worldwide, making it accessible to engineers and manufacturers across various sectors, enhancing their design capabilities.

Typical Applications
The versatility and reliability of RT/Duroid 6035HTC make it ideal for a range of applications, including:

High-Power RF and Microwave Amplifiers: Essential for effective signal amplification in communication systems.
 

Power Amplifiers and Couplers: Providing stable performance in demanding RF environments.
 

Filters and Combiners: Enabling effective signal management in complex circuits.
 

Power Dividers: Facilitating reliable signal distribution in RF applications.

Conclusion
The RT/Duroid 6035HTC PCB is a transformative solution for high-frequency and high-power applications. As the electronics industry continues to evolve, RT/Duroid 6035HTC is positioned to meet the challenges of tomorrow's high-power applications, ensuring that your designs are both reliable and efficient.