Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RT/duroid 5880LZ |
| Layer count | 2-layer |
| PCB size | 90.63mm x 170.35 mm=1PCS, +/- 0.15mm |
| PCB thickness | 20mil |
| Copper weight | 1oz (1.4 mils) outer layers |
| Surface finish | OSP |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RT/duroid 5880LZ | Layer count | 2-layer |
| PCB size | 90.63mm x 170.35 mm=1PCS, +/- 0.15mm | PCB thickness | 20mil |
| Copper weight | 1oz (1.4 mils) outer layers | Surface finish | OSP |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | OSP Double-Sided Circuit PCB ，20mil Double-Sided Circuit PCB ，RT duroid 5880LZ PCB | ||
Introducing the RT/duroid 5880LZ PCB, a cutting-edge solution designed for high-performance applications requiring precision and reliability. Crafted from Rogers RT/duroid 5880LZ laminates, this PCB is engineered with filled PTFE composites ideal for strip-line and micro-strip circuit applications. With its unique filler composition, this laminate offers a lightweight, low-density material perfect for weight-sensitive environments.
Key Features
- Dielectric Constant (DK): 2.0 ± 0.04 at 10 GHz and 23°C
- Dissipation Factor: Ranges from 0.0021 to 0.0027 at 10 GHz and 23°C
- Low Z-Axis Coefficient of Thermal Expansion: 40 ppm/°C
- Outgassing Properties: TML 0.01%, CVCM 0.01%, WVR 0.01%
- Density: Lightweight at 1.4 gm/cm3
- Flammability Rating: UL 94V-0
- Lead-Free Process Compatibility: Ensures compliance with modern manufacturing standards
Benefits
- Lightweight Design: Reduces overall system weight without compromising performance.
- Uniform Electrical Properties: Maintains consistent performance across a wide frequency range.
- Chemical Resistance: Durable against solvents and reagents used in etching and plating processes.
| RT/duroid 5880 Typical Value | ||||||
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
| PCB Material: | Unique PTFE Composites |
| Designation: | RT/Duroid 5880LZ |
| Dielectric constant: | 2 |
| Dissipation Factor | 0.0021 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
The construction of this PCB is meticulously engineered. It comprises a 2-layer rigid stackup, featuring 35 μm of copper on both layers and a 0.508 mm (20 mil) core of RT/duroid 5880LZ. With precise dimensions of 90.63 mm x 170.35 mm (± 0.15 mm) and a finished thickness of 0.6 mm, this PCB accommodates minimum trace and space requirements of 4/5 mils, and a minimum hole size of 0.2 mm. The PCB is compatible with lead-free processes and adheres to UL 94V-0 flammability standards, ensuring both safety and environmental compliance.
The RT/duroid 5880LZ PCB is supplied with artwork in the Gerber RS-274-X format, ensuring compatibility with industry-standard design software for seamless integration into your projects. It adheres to the IPC-Class-2 quality standard, guaranteeing a reliable performance suitable for a wide range of applications. Additionally, this product is available worldwide, making it accessible to a global market of engineers seeking high-performance PCB solutions.
This PCB is versatile and suitable for a variety of advanced applications, including airborne antenna systems, lightweight feed networks, radar systems, guidance systems, and point-to-point digital radio antennas. With its impressive specifications and robust performance, the RT/duroid 5880LZ PCB stands out as a valuable asset for modern communication and defense technologies, meeting the high demands of contemporary electronic designs.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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