Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Material | RO3006 |
| PCB thickness | 25mil |
| PCB size | 51.31 mm x 111.92 mm |
| Layer count | 2-layer |
| Copper weight | 1OZ |
| Surface finish | Immersion Gold |
| Silkscreen | White |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Material | RO3006 | PCB thickness | 25mil |
| PCB size | 51.31 mm x 111.92 mm | Layer count | 2-layer |
| Copper weight | 1OZ | Surface finish | Immersion Gold |
| Silkscreen | White | Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | Immersion Gold PCB ，25mmil PCB ，Rogers RO3006 PCB | ||
Rogers RO3006 PCB 25mmil 2-Layer Immersion Gold Circuit Boards
Introducing our high-performance Rogers RO3006 PCB, designed with advanced ceramic-filled PTFE composite materials that ensure exceptional electrical and mechanical stability. With its consistent dielectric properties, this PCB is engineered to excel in demanding applications across various industries.
Key Features
- Material: Rogers RO3006 ceramic-filled PTFE composites
- Dielectric Constant: 6.15 ± 0.15 at 10 GHz, 23°C
- Dissipation Factor: 0.002 at 10 GHz, 23°C
- Thermal Properties: Td > 500°C, Thermal Conductivity of 0.79 W/mK
- Moisture Absorption: 0.02%
- Coefficient of Thermal Expansion: X/Y axes: 17 ppm/°C, Z axis: 24 ppm/°C (-55 to 288 °C)
| Property | RO3006 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.27 0.15 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1498 1293 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.86 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Benefits
- Uniform Mechanical Properties: Ideal for multi-layer board designs, especially where a range of dielectric constants is required.
- Low In-Plane Expansion Coefficient: Matches copper expansion, ensuring reliable surface-mounted assemblies, making it perfect for temperature-sensitive applications.
- Cost-Effective Manufacturing: Our volume manufacturing process allows for economical laminate pricing without compromising quality.
PCB Specifications
- Construction:
- Copper Layer 1: 35 μm
- Rogers RO3006 Substrate: 25 mil (0.635 mm)
- Copper Layer 2: 35 μm
The Rogers RO3006 PCB measures 51.31 mm x 111.92 mm and consists of two pieces, making it versatile for various applications. Manufacturing specifications include a minimum trace/space of 5/4 mils and a minimum hole size of 0.4 mm. The finished board thickness is 0.76 mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, and the surface finish is immersion gold for enhanced durability.
The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is green, improving trace visibility. To ensure reliability, each PCB undergoes 100% electrical testing before shipment.
| PCB Material: | Ceramic-filled PTFE Composites |
| Designation: | RO3006 |
| Dielectric constant: | 6.15 |
| Dissipation Factor | 0.002 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Laminate thickness: | 5mil(0.127mm), 10mil(0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Artwork and Standards
- Artwork Provided: Gerber RS-274-X
- Accepted Standard: IPC-Class-2
- Availability: Worldwide
Typical Applications
Our Rogers RO3006 PCB is ideally suited for:
- Automotive radar applications
- Global positioning satellite antennas
- Cellular telecommunications systems (power amplifiers and antennas)
- Patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
Elevate your projects with the reliability and performance of the Rogers RO3006 PCB—engineered for excellence in demanding application.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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