Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| PCB material | RO3003G2 |
| Layer count | 2 layers |
| Dielectric constant | 3 |
| Dissipation factor | 0.0011 |
| PCB size | ≤400mm X 500mm |
| Copper weight | 1oz (35µm), 2oz (70µm) |
| Brand Name | Bicheng |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| PCB material | RO3003G2 | Layer count | 2 layers |
| Dielectric constant | 3 | Dissipation factor | 0.0011 |
| PCB size | ≤400mm X 500mm | Copper weight | 1oz (35µm), 2oz (70µm) |
| Brand Name | Bicheng | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | China | ||
| High Light | Ceramic-Filled PTFE Laminates PCB Board ，PCB Board RO3003G2 ，2 Layers High Frequency PCB | ||
Material Introduction
The high-frequency, ceramic-filled PTFE laminates of Rogers RO3003G2 are an extension of Rogers' industry-leading RO3003 solutions. The development of RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications.
The incorporation of an optimized resin and filler content, along with the utilization of Very Low Profile ED copper provides a reduced insertion loss. This characteristic makes RO3003G2 laminates well-suited for implementation in Advanced Driver Assistance Systems (ADAS) such as adaptive cruise control, forward collision warning, active braking, and lane change assist.
Features
1. The dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz.
2. Very Low Profile (VLP) ED copper.
3. Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity.
4. Enhanced filler system.
Benefits
1. Best-in-class performance for insertion loss.
2. Minimize variation in dielectric constant in the finished PCB.
3. Enable the trend towards using smaller diameter vias; Enhanced filler system using small rounded particles
4. Global manufacturing footprint.
Our PCB Capability (RO3003G2 laminates)
| PCB Material: | Ceramic-filled PTFE Laminates |
| Designation: | RO3003G2 |
| Dielectric constant: | 3 |
| Dissipation factor | 0.0011 |
| Layer count: | Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 5mil (0.127mm), 10mil (0.254mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
Typical Applications
1. Adaptive cruise control
2. Forward collision warning
3. Active brake assist
4. Lane change assist
5. Traffic jam pilot
6. Parking pilot
7. Blind spot detection
RO3003G2’s Data Sheet
| PROPERTY | RO3003G2 | Direction | Unit | condition | Test Method |
| Dielectric Constant, er Process | 3.00 ± 0.04 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, er Design | 3.07 | Z | - | 77 GHZ | Differential Phase Length Method |
| Dissipation Factor, tan d | 0.0011 | Z | - | 10 GHz 23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of er | -35 | Z | ppm/°C | 10 GHz -50 to 150°C | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | -0.16 -0.14 | X Y | mm/m | Method C | IPC TM-650 2.2.4 |
| Volume Resistivity | 1.4 x 109 | - | MΩ•cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 2.6 x 108 | - | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 378 396 | X Y | ksi | 23°C | ASTM D638 |
| Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.73 0.83 | Z | J/g/K | 0°C 50°C | ASTM E1269-11 |
| Thermal Conductivity | 0.43 | Z | W/m/K | 50°C | ASTM D5470 |
| Coefficient of Thermal Expansion | 16 17 18 | X Y Z | ppm/°C | 23°C/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | - | °CTGA | - | ASTM D3850 |
| Density | 2.15 | - | gm/cm3 | 23°C | ASTM D792 |
| Copper Peel Strength | 12.0 | - | lb/in | 1/2 oz. EDC After Solder Float | IPC-TM-2.4.8 |
| Flammability | V-0 | - | - | - | UL 94 |
| Lead Free Process Compatible | YES | - | - | - | - |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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