Bicheng Electronics Technology Co., Ltd
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Product Specification
| High Light | 2 Layer High Frequency PCB ，Laminates High Frequency PCB ，30 Mil High Frequency PCB | ||
Rogers' RO4730G3 high frequency laminates are a dependable choice for antenna-grade printed circuit board substrates, offering a cost-effective alternative to traditional PTFE-based antenna substrates while enabling designers to fine-tune cost and performance. With a dielectric constant of 3 and a loss tangent of 0.0028 at 10 GHz, it also boasts a low thermal coefficient of dielectric constant (TCDk) of only 34 ppm/°C across a temperature range of -50°C to 150°C. Additionally, these high frequency PCBs have demonstrated low PIM performance, with a value of -165 dBc. The CTE values on both the X and Y axes are similar to that of copper, and the Z-axis CTE is impressively low at 30.3 ppm/°C. This superb CTE match significantly reduces stresses in the PCB antennas.
| Property | RO4730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.0±0.5 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.98 | Z | 1.7 GHz to 5 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0028 | Z | 10 GHz 23℃ | IPC-TM-650 2.5.5.5 | |
| 2.5 GHz | |||||
| Thermal Coefficient of ε | +34 | Z | ppm/℃ | -50 ℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | <0.4 | X, Y | mm/m | after etech +E2/150 ℃ | IPC-TM-650 2.4.39A |
| Volume Resistivity (0.030") | 9 X 107 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity (0.030") | 7.2 X 105 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| PIM | -165 | dBc | 50 ohm 0.060" | 43 dBm 1900 MHz | |
| Electrical Strength (0.030") | 730 | Z | V/mil | IPC-TM-650 2.5.6.2 | |
| Flexural Strength MD | 181 (26.3) | Mpa (kpsi) | RT | ASTM D790 | |
| CMD | 139 (20.2) | ||||
| Moisure Absorption | 0.093 | - | % | 48/50 | IPC-TM-650 2.6.2.1 ASTM D570 |
| Thermal Conductivity | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Coefficient of Thermal Expansion | 15.9 14.4 35.2 | X Y Z | ppm/℃ | -50 ℃to 288℃ | IPC-TM-650 2.4.4.1 |
| Tg | >280 | ℃ | IPC-TM-650 2.4.24 | ||
| Td | 411 | ℃ | ASTM D3850 | ||
| Density | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Stength | 4.1 | pli | 1oz,LoPro EDC | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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