Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | RT/duroid 5880LZ 1.27mm |
| Layer count | 2 layers |
| PCB thickness | 1.4 mm ±0.1 |
| PCB size | 75 x 60mm=1up |
| Solder mask | Green |
| Copper weight | 1oz |
| Surface finish | Immersion gold |
| Brand Name | Bicheng |
| Model Number | BIC-192.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | RT/duroid 5880LZ 1.27mm | Layer count | 2 layers |
| PCB thickness | 1.4 mm ±0.1 | PCB size | 75 x 60mm=1up |
| Solder mask | Green | Copper weight | 1oz |
| Surface finish | Immersion gold | Brand Name | Bicheng |
| Model Number | BIC-192.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | PCB Rogers Printed Circuit Board ，2 Layer Rogers 5880 PCB Board ，PCB Board With Immersion Gold | ||
Rogers 5880LZ High Frequency PCB RT/duroid 5880LZ 50mil 1.27mm 2-Layer Circuit Board with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This is a type of digital radio antenna PCB made on Rogers RT/duroid 5880LZ with 50mil substrate, starting 0.5oz copper, finished 1oz copper, green solder mask on top side and immersion gold plated on whole bottom layer. It is a double layer board manufactured as per IPC class 2 standard. All of the boards are 100% electrical tested, flying probe or test fixture, before shipment.
PCB Specifications
| PCB SIZE | 75 x 60mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| RT/duroid 5880LZ 1.27mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.4 mm / 3.0 mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 175 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RT/duroid 5880LZ 1.27mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 1.4 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 51.8% |
| Solder Mask Apply To: | Top side |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | N/A |
| Colour of Component Legend | N/A |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Our Advantages
Our PCB Capabilities(2022)
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; RT/duroid 5880LZ; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--350µm (1oz-10oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0079" - 0.25" (0.2mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Appendix: Typical Value of RT/duroid 5880LZ
| Property | Typical Value RT/duroid® 5880LZ | Direction | Units | Condition | Test Method |
| Dielectric Constant er,Process | 2.00 ± 0.04 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant er,Design | 2.00 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor, tan | Typ: 0.0021 Max: 0.0027 | Z | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Thermal Coefficient of Dielectric Constant, er | +20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 X 10^7 | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 X 10^6 | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | KV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47 40 | X,Y Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing | |||||
| TML | 0.01 | % | ASTM E-595 | ||
| CVCM | 0.01 | ||||
| WVR | 0.01 | ||||
| Density | 1.4 | gm/cm^3 | ASTM D792 | ||
| Copper Peel | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Compatible | YES | ||||
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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