Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Organic-ceramic Laminate based on Woven Glass Reinforcement. |
| Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 25mil (0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm) |
| PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. |
| Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG,Silver, Tin and OSP etc.. |
| Brand Name | Bicheng |
| Model Number | BIC-094.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Organic-ceramic Laminate based on Woven Glass Reinforcement. | Layer count | Double Layer, Multilayer, Hybrid PCB |
| PCB thickness | 25mil (0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm) | PCB size | ≤400mm X 500mm |
| Solder mask | Green, Black, Blue, Yellow, Red etc. | Copper weight | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Surface finish | Bare copper, HASL, ENIG,Silver, Tin and OSP etc.. | Brand Name | Bicheng |
| Model Number | BIC-094.V1.0 | Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA | ||
| High Light | 25mil RF PCB Board ，0.635mm RF PCB Board ，Multilayer RF PCB Board | ||
Taconic RF PCB on CER-10 with 25mil, 30mil, 47mil and 50mil
(PCB's are custom-made products, the picture and parameters shown are just for reference)
CER-10 is an organic-ceramic DK-10 laminate in the ORCER family of Taconic products. It is based on a woven glass reinforcement. CER-10 exhibits exceptional interlaminar bond strength and solder resistance. Its proprietary composition results in low moisture absorption and uniform electrical properties.
Benefits:
Exceptional Interlaminar Bond
Low moisture absorption
Enhanced dimensonal stability
Low Z-Axis expansion
Stable DK over frequency
Increased flexural strength
Circuit board miniturization
Applications:
Power amplifiers
Filters and couplers
Passive components
CER-10’s woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. This DK-10 laminate exhibits low Z-axis expansion (CTE 46 ppm/°C), allowing for plated-through-hole reliability in extreme thermal environments.
CER-10 laminates exhibit flammability of V-0 and are tested in accordance with IPC-TM 650. A certificate of conformance containing lot-specific data accompanies each shipment.
Our PCB Capability (CER-10)
| PCB Material: | Organic-ceramic Laminate based on Woven Glass Reinforcement. |
| Designation: | CER-10 |
| Dielectric constant: | 10 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 25mil (0.635mm), 30mil(0.762mm), 47mil(1.194mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG,Silver, Tin and OSP etc.. |
Typical Value of CER-10
| Property | Test Method | Unit | Value | Unit | Value |
| Dielectric Constant (Nominal) | IPC-TM-650 2.5.5.6 | 10 | 10 | ||
| Dissipation Factor 10 GHz | IPC-TM-650 2.5.5.5.1 | 0.0035 | 0.0035 | ||
| Moisture Absorption | IPC-TM-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | kV | 44 | kV | 44 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | Mohm/cm | 2.1 x 108 | Mohm/cm | 2.1 x 108 |
| Surface Resistivity | IPC-TM-650 2.5.17.1 | Mohm | 1.1 x 109 | Mohm | 1.1 x 109 |
| Arc Resistance | IPC-TM-650 2.5.1 | Seconds | >180 | Seconds | >180 |
| Flexural Strength (MD) | ASTM D 790 | psi | 16500 | N/mm2 | 114 |
| Flexural Strength (CD) | ASTM D 790 | psi | 15500 | N/mm2 | 107 |
| Tensile Strength (MD) | ASTM D 638 | psi | 7700 | N/mm2 | 53 |
| Tensile Strength (CD) | ASTM D 3039 | psi | 6700 | N/mm2 | 46 |
| Peel Strength (1 oz. ED) | IPC-TM-650 2.4.8 | lbs/linear inch | 9 | N/mm | 1.61 |
| Dimensional Stability (MD) | IPC-TM-650 2.4.39 | in/in | -0.0002 | mm/mm | -0.0002 |
| Dimensional Stability (CD) | IPC-TM-650 2.4.39 | in/in | -0.0003 | mm/mm | -0.0003 |
| Density (Specific Gravity) | g/cm3 | 3.05 | g/cm3 | 3.05 | |
| Thermal Conductivity | ASTM F 433 | W/m/K | 0.63 | W/m/K | 0.63 |
| CTE (x-y) | ASTM D 3386 (TMA) | ppm/℃ | 13-15 | ppm/℃ | 13-15 |
| CTE (z) | ASTM D 3386 (TMA) | ppm/℃ | 46 | ppm/℃ | 46 |
| Outgassing (%TML) | ASTM E 595 | % | 0.02 | % | 0.02 |
| Outgassing (%CVCM) | ASTM E 595 | % | 0.01 | % | 0.01 |
| Outgassing (%WVR) | ASTM E 595 | % | 0.01 | % | 0.01 |
| Flammability Rating | UL 94 | V-0 | V-0 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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