Shenzhen Hansome Technology Co., Ltd.
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days |
| Packaging Details | Wooden package |
| Product Name | BGA Rework Station |
| Warranty | 1 Year |
| Control | Touch Screen |
| Condition | New |
| Thickness | 0.3 - 5mm |
| Signal | SMEMA |
| Application | Electronic Assembly |
| Power Supply | AC220V |
| Working Environment | 30KG |
| Type | Automatic |
| Brand Name | HSTECH |
| Model Number | HS-520 |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram | Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days | Packaging Details | Wooden package |
| Product Name | BGA Rework Station | Warranty | 1 Year |
| Control | Touch Screen | Condition | New |
| Thickness | 0.3 - 5mm | Signal | SMEMA |
| Application | Electronic Assembly | Power Supply | AC220V |
| Working Environment | 30KG | Type | Automatic |
| Brand Name | HSTECH | Model Number | HS-520 |
| Certification | CE | Place of Origin | China |
Industrial Touch Screen 3 Heating Zones Manual BGA Rework Station with & CE
Introduction:
A BGA Rework Station is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (BGA) components on printed circuit boards (PCBs). These components are popular due to their high density and performance but can be challenging to work with when defects occur.
Features:
1.Repair Success Rate:More Than 99%
2.Using The Industrial Touch Screen
3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)
4.With CE Certification.
Specification:
| Manual BGA Rework Station | Model:HS-520 |
| Power Supply | AC 220V±10% 50/60Hz |
| Total power | 3800W |
| Overall dimension | L460mm*W480mm*H500mm |
| PCB size | Max 300mm*280mm Min 10mm*10mm |
| BGA size | Max 60mm*60mm Min 1mm*1mm |
| PCB thickness | 0.3-5mm |
| Weight of machine | 20KG |
| Warranty | 3 years (1st year is free) |
| Usage Repair | chips / phone motherboard etc |
Applications
BGA Component Replacement:
Used to remove faulty BGA components and replace them with new ones, essential for repairs and upgrades.
Solder Joint Repair:
Facilitates the reflow of solder joints for reworking connections that may have failed or become cold soldered.
Prototyping:
Useful in prototyping environments where BGA components need to be frequently replaced or modified.
Quality Control:
Employed in quality control processes to inspect and repair PCBs before final assembly or shipment.
Benefits
Increased Reliability:
Enables effective repair of BGA components, extending the life of PCBs and reducing waste.
Cost-Effective Repairs:
Reduces the need for complete PCB replacements, saving costs in manufacturing and maintenance.
Enhanced Precision:
Provides precise temperature control and alignment for high-quality rework results, ensuring the integrity of the PCB.
Time Efficiency:
Streamlined rework processes allow for quicker turnaround times in manufacturing and repair environments.
Flexibility:
Can handle various sizes and types of BGA components, making them versatile for different applications.
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
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