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Studio Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier

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China Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing
China Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing

  1. China Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing

Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing

  1. MOQ: No MOQ
  2. Price: Quote based on your specs
  3. Get Latest Price
Supply Ability 100,000 pieces per month
Packaging Details ESD Protective Packaging/Customization
Delivery Time 5-25 working days(varies by product)
Payment Terms T/T
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Supply Ability 100,000 pieces per month Packaging Details ESD Protective Packaging/Customization
Delivery Time 5-25 working days(varies by product) Payment Terms T/T
Place of Origin China
High Light oem pcb manufacturing ,void free bga pcb assembly ,bga pcb assembly x ray
Precision BGA Assembly – Void-Free X-Ray Testing

Overview

Voids within BGA solder balls are a critical quality concern—excessive voids reduce mechanical strength, increase electrical resistance, and can cause premature field failures. Studio Electronics offers Precision BGA Assembly with void-free X-Ray testing, utilizing advanced 3D X-Ray systems to detect and quantify voids in every BGA solder ball. As a premier provider of PCB assembly in China, we combine process optimization, nitrogen reflow technology, and comprehensive X-Ray inspection to achieve void rates well below IPC requirements. Our complete turnkey service covers component procurement through final shipping.


Void Control – Our Precision Approach

Void Control Parameter Studio's Capability Target/Result
X-Ray Detection 3D X-Ray with automated void calculation Voids detected to sub-5μm resolution
Void Percentage Target <15% per ball (IPC Class 2/3) Consistently achieved; <10% for critical applications
Process Optimization Reflow profile; stencil design; nitrogen reflow Minimizes void formation during soldering
Board Pre-Bake Moisture removal before assembly Prevents outgassing; reduces voiding
Flux Selection Optimized flux for BGA applications Improved wetting; reduced voiding
Documentation X-Ray images and void data per board serial number Complete traceability; audit-ready records

Our Precision BGA Assembly Process

Stage 1: Component Sourcing & Pre-Treatment
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Board pre-baking removes moisture, preventing void-causing outgassing.

Stage 2: Stencil Design & Solder Paste
Optimized stencil aperture geometry. 3D SPI verifies paste deposition consistency.

Stage 3: Precision BGA Placement
12 SMT lines with ±25μm accuracy. Vision alignment ensures accurate ball-to-pad registration.

Stage 4: Nitrogen Reflow
Nitrogen atmosphere reflow minimizes oxidation and reduces void formation. Custom profiles per BGA type.

Stage 5: 3D X-Ray Void Analysis (100% Coverage)

  • 3D X-Ray – Every BGA inspected; automated void calculation per ball

  • Void Percentage – Calculated and reported per ball

  • Acceptance Criteria – <15% void per ball (Class 2/3); <10% for critical applications

  • Documentation – Void data per board serial number

Stage 6: Quality Testing & Final Assembly
ICT; Flying Probe; FCT; AOI for visible components. Careful handling; anti-static packaging; global logistics.


Why Void-Free X-Ray Testing Matters

Void Level Mechanical Impact Electrical Impact Studio's Solution
<15% (IPC Class 2/3) Acceptable for standard applications Acceptable for standard applications Studio's standard target; consistently achieved
<10% Enhanced mechanical strength Reduced resistance; improved performance Studio's critical application target
>25% Significant strength reduction Increased resistance; overheating risk Detected and flagged for rework

Studio delivers Precision BGA Assembly—void-free X-Ray testing ensuring every BGA solder joint meets quality standards.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2003

  • Total Annual:

    30000000-40000000

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

Leading PCB Assembly & Turnkey Manufacturing Services in China Studio is a premier electronics manufacturing service (EMS) provider in China, specializing in low volume PCB assembly and high-mix production. As an intelligent factory, we excel in one-stop turnkey solutions—from engineeri... Leading PCB Assembly & Turnkey Manufacturing Services in China Studio is a premier electronics manufacturing service (EMS) provider in China, specializing in low volume PCB assembly and high-mix production. As an intelligent factory, we excel in one-stop turnkey solutions—from engineeri...

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  • Studio Technology Co., Ltd.
  • No. 1 Getian Road, Xin'an, Chang'an Town, Dongguan City, Guangdong Province, China
  • https://www.pcbassemblyturnkey.com/

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