ONESEINE TECHNOLOGY CO.,LTD
| Payment Terms | T/T,Western Union |
| Supply Ability | 1000000000pcs/mon |
| Delivery Time | 5-8 working days |
| Packaging Details | Vacuun bag |
| Max Pcb Size | 700 × 460mm |
| Number Of Layers | 1-48 |
| Impedance Control | Yes |
| Certifications | ISO 9001, ISO 14001, RoHS, UL |
| Thicker Copper | 0.5-10OZ |
| Board Cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
| Brand Name | ONESEINE |
| Model Number | ONE-102 |
| Certification | ISO9001,ISO14001 |
| Place of Origin | Shenzhen,China |
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Product Specification
| Payment Terms | T/T,Western Union | Supply Ability | 1000000000pcs/mon |
| Delivery Time | 5-8 working days | Packaging Details | Vacuun bag |
| Max Pcb Size | 700 × 460mm | Number Of Layers | 1-48 |
| Impedance Control | Yes | Certifications | ISO 9001, ISO 14001, RoHS, UL |
| Thicker Copper | 0.5-10OZ | Board Cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
| Brand Name | ONESEINE | Model Number | ONE-102 |
| Certification | ISO9001,ISO14001 | Place of Origin | Shenzhen,China |
| High Light | ISO9001 printed circuit board pcba ，epoxy resin printed circuit board pcba ，resin quick turn printed circuit boards | ||
Full-Scale PCB Assembly Solutions for Complex Circuit Boards
General PCBA Information:
Base material:FR4 epoxy resin
Board thickness:1.6mm
Surface finish:Immersion gold
Board size:7.2*17.3CM
Copper thickness:1OZ
Solder mask and silkscreen: green and white
Components sourcing:yes
Technical requirement for pcb assembly:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
| Quantity | Prototype&Low Volume PCB Assembly&Mass production(without MOQ) |
| Type of Assembly | SMT,DIP&THT |
| Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| Components | Passive Down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP |
| Bare Board Size | Smallest:0.25*0.25 inches ; Largest:20*20 inches |
| File Format | Bill of Materials; Gerber files; Pick-N-Place file |
| Types of Service | Turn-key,partial turn-key or consignment |
| Component Package | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test; X-ray Inspection; AOI Test |
| PCBA Process | SMT--Wave Soldering--Assembling--ICT--Function Testing |
Our PCBA Capability
SMT, PTH, mixed technology
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Press fit back planes & mid planes
Device programming
Automated conformal coating
For E-Test
Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solder ability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
Quote requirement for pcb and pcb assembly:
1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD file all acceptable
2)Clear pics of pcba or pcba sample for us This will help a lot for the fast purchasing as request
3)Test method for PCBA This can guarantee 100% good quality products when delivered
Assembly Capabilities
· Printed Circuit Board Assembly (PCBA)
· Through Hole
· Surface Mount (SMT)
· PCB Handling up to 400mm x 500mm
· RoHS Compliance Production
· Non RoHS Production – where permitted
· AOI
Component Technologies
· Passive Down to 0201 size
· BGA and VFBGA
· Leadless Chip Carriers/CSP
· Fine Pitch to 0.8mils
· BGA Repair and Reball
· Part Removal and Replacement
Your End-to-End PCB Assembly Solution for Demanding Circuit Boards
Today’s innovations demand circuit boards that push the boundaries: dense multilayer designs, intricate HDI layouts, advanced RF components, and ultra-fine-pitch BGAs. If your project involves complex PCB assembly, partnering with a manufacturer equipped for the challenge isn't just beneficial – it's critical for success.
Why "Standard" Assembly Falls Short for Complex Boards:
Complex PCBs introduce unique hurdles that generic assemblers often struggle with:
Microscopic Precision: Placing 01005 components or 0.3mm pitch BGAs requires advanced equipment and meticulous process control.
Advanced Materials: Handling high-frequency laminates (Rogers, Taconic) or heavy copper boards demands specialized expertise.
Intricate Layer Stacks: Managing 20+ layers, blind/buried vias, via-in-pad, and impedance control needs deep engineering collaboration.
Demanding Technologies: Integrating mixed-signal designs, embedded components, RF shielding, and strict thermal management requires proven capability.
Supply Chain Agility: Securing specialized, long-lead, or obsolete components for complex BOMs is a constant battle.
Company Details
Business Type:
Manufacturer
Year Established:
2013
Total Annual:
1000000-5000000
Employee Number:
100~200
Ecer Certification：
Verified Supplier
ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+... ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+...
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