6 Layer Medical X-Ray Inspection PCB with OSP Finish

6 Layer Medical Equipment X-Ray Inspection Fr4 PCB Material Specification

Quick Details

Place of Origin:Guangdong, China (Mainland)

Brand Name:ONESEINE

Base Material:FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum

Copper Thickness:1oz

Board Thickness:1.6mm

Min. Hole Size:0.20mm

Min. Line Width:0.254mm

Min. Line Spacing:3mil

Surface Finishing:HASL Immersion Gold OSP

Product name:6 Layer Medical Equipment X-ray Detector PCB printed circuit board

Certificate:ISO 9001:2008/ISO

Item:PCBA Electronic

Solder mask:Double-sided Green LPI

Testing Service:X-Ray

SMT Efficiency:TQFP

Shipping:DHL UPS TNT Fedex

Application:Medical Device Consumer,Telecom,Industrial,Aero Industry

PCB material:FR4

Applicaitons:

1, communication industry

2, medical equipments

3, consumer electronics

4, automobile industry

Our Advantage:

Competitive price with superior quality and stable reliability.

On-time delivery for sample, quick-turn, pilot run and large volumes.

Professional technical supports and prompt response to customers’ requests.

Logistics supports, various choice of shipping method, UPS, DHL, Fedex, sea/air cargoes.

Flexible payment choice, T/T, L/C and so on

Features:

1. With the strong support of advanced R&D Dept and equipment, your products are well guaranteed.

2. We put our customers' requirement always first, try our best to meet your demand.

3. printed circuit board prototype pcb prototypes pcb design.

 High frequency telecom.high speed transmission high security.

 High transmission quality.high memory  transaction

 Specification

  PCB     

 Single.double Sided PCB       

 NPTH,PTH

 Conductor width control:      ±0.02mm

 Hole wall copper   ≥ 20μм

 Thermal stress       288°C.10sec.

 Permitivity    ε2.1-10.0

 Profile:punching or routing.tolerance   ±0.10.0-0.13mm

 Final product thickness         0.5,0.8,1.0,1.2,1.6mm

 Base copper thickness    Normal 0.5 1.0 OZ

 Solder Mask    Taiyo PSR4000.Tamura DSR2200

 Solder mask thickness on tracks      20-30 μм

FR4 Material Types

FR-4 has many different variations depending on the thickness of the material and chemical properties, such as the standard FR-4 and G10. The following list shows some common designations for FR4 PCB materials.

Standard FR4: This is the most common type of FR4. It provides good mechanical and moisture resistance, with heat resistance of about 140℃ to 150℃.

FR4 With High Tg: FR4 with high Tg is suitable for applications requiring high thermal cycling and temperatures greater than 150℃. Standard FR4 is limited to around 150℃, while FR4 with high Tg can withstand much higher temperatures.

FR4 With High CTI: FR4 with high CTI (Chemical Thermal Interaction) has better thermal conductivity than regular FR4 material. It has a comparative tracking index higher than 600 Volts.

FR4 without copper laminate: FR4 without copper laminate is a non-conductive material with excellent mechanical strength. It is mainly suitable for insulating boards and board supports.

FR4 G10: FR-4 G10 is a solid core material with excellent mechanical properties, high thermal shock resistance, excellent dielectric properties, and good electrical insulation properties.

The requirements of high frequency pcb material:

(1) the dielectric constant (Dk) must be very stable

(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.

(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.

(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

ONESEINE'S STANDARD FR-4 MATERIAL PROPERTIES

High Glass Transition Temperature (Tg) (150Tg or 170Tg)

High Decomposition Temperature (Td) (> 345º C)

Low Coefficient of Thermal Expansion (CTE) ((2.5%-3.8%)

Dielectric Constant (@1 GHz): 4.25-4.55

Dissipation Factor (@ 1 GHz): 0.016

UL rated (94V-0, CTI = 3 minimum)

Compatible with standard and lead-free assembly.

Laminate thickness available from 0.005” to 0.125”

Pre-preg thicknesses available (approximate after lamination):

(1080 glass style) 0.0022”

(2116 glass style) 0.0042”

(7628 glass style) 0.0075”