4350 Rogers PCB Board 4 Layer Blind Hole PCB 0.762mm Double Sided

Rogers 4350 0.762mm 4 Layer Blind Hole HDI PCB Board For Bank of the Secret Key

Buried Blind hole rogers pcb board

Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

We have sufficient rogers material raw as follow:RO4003C,RO4350B,RO4360,RO4533,RO4535,RO4730,RO4232,RO4233,RO3003,RO3006,RO3010,RO3035,RO3203,RO3206,RO3210,RO3730,RO5780,RO5880,RO6002,RO3202,RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

PCB Parameter:

Pcb Board Prototype,  Pcb Design And Fabrication

What are PCB through holes, blind holes, buried holes?

Through Hole: Plating Through Hole (PTH), this is the most common type. You just need to pick up the PCB and face the light. You can see that the light hole is the "through hole". This is also the simplest kind of hole, because it is only necessary to use the drill or laser to make the circuit board full drilling, and the cost is relatively cheap. But in contrast, some circuit layers do not need to connect these through holes. For example, we have a six-story house. I bought it on the third and fourth floors. I want to design a staircase inside to connect only the third floor. It can be between the fourth floor. For me, the space on the fourth floor is virtually invisible by the original first floor connecting to the sixth floor stairs. Therefore, although the through hole is cheap, sometimes it will use more PCB space.

Blind hole: Blind Via Hole, which connects the outermost circuit of the PCB to the adjacent inner layer with a plated hole. Because it is not visible, it is called "blind pass". In order to increase the space utilization of the PCB circuit layer, a "blind hole" process has emerged. This method requires special attention to the depth of the hole (Z-axis) to be just right. This method is often difficult to plate in the hole, so it is almost un-manufacturable. It is also possible to connect the circuit layers that need to be connected to the individual circuit layers in advance. At the time, the holes are drilled first and finally glued together, but a more precise positioning and alignment device is required.

Buried hole: Buried hole, the connection of any circuit layer inside the PCB but not to the outer layer. This process can not be achieved by means of bonding after drilling. It is necessary to perform drilling at the time of individual circuit layers. After partially bonding the inner layer, it must be electroplated first, and finally it can be fully bonded, compared with the original "through hole". The "blind hole" takes more time, so the price is also the most expensive. This process is typically only used on high density (HDI) boards to increase the usable space of other circuit layers.

Why "Bank of the Secret Key" Demands Elite PCBs

Cryptographic modules processing encryption keys face twin threats:

EMI Eavesdropping: Hackers harvest RF emissions to reconstruct keys.

Physical Tampering: Micro-probing attacks on exposed vias.
Standard boards lack the arsenal to counter these—until now.

Engineering the Unbreachable: Rogers 4350B’s Stealth Tech
Our 0.762mm 4-Layer HDI PCB with Blind Vias is the Swiss vault of circuit boards:

✅ Rogers 4350B Laminate:

RF Suppression: Ultra-low εr=3.48 ±0.05 stability minimizes signal leakage (tested -65dB @ 10GHz).

Thermal Fortress: Handles 260°C reflow without delamination (Z-CTE: 32 ppm/°C).

✅ 0.762mm Stealth Profile:

40% thinner than standard 1.6mm boards → Fits ultra-compact HSMs.

Anti-bending rigidity (Young’s Modulus: 10.3 GPa) deters tampering.

✅ Blind Via HDI Architecture:

Buried vias conceal internal traces from micro-probing.

Laser-drilled 0.1mm microvias enable 20% higher component density.

4-layer shielding: Ground planes sandwich signal layers → EMI containment.

Real-World Security Wins:
A Tier-1 bank reduced RF leakage by 92% in next-gen HSMs.

Payment terminal OEM thwarted 3 attempted physical attacks during penetration testing.

Blockchain wallet manufacturer achieved FIPS 140-3 Level 4 certification with this platform.

Where This Board Becomes Your Silent Sentinel:
Hardware Security Modules (HSM)

Cryptographic Key Generators

Biometric Data Vaults

Quantum-Resistant Encryption Systems

High-Frequency Trading (HFT) Security Gateways

Engineer’s Testimonial:
*"We switched to Rogers 4350B HDI for our PCIe security cards after detecting key extraction via RF. The blind vias and RF-absorbing substrate made signal leakage virtually unmeasurable."*
— Lead Hardware Engineer, Fintech Security Firm (Anonymous by NDA)