Shenzhen Hansion Technology Co., Ltd.
| Payment Terms | Western Union,T/T |
| Supply Ability | 10000PCS per month |
| Delivery Time | 3-5days |
| Packaging Details | foam+custom box |
| Silkscreen Color | White, Black, Yellow |
| Material | FR4 |
| Minimum Trace/Space | 4/4 mil |
| Copper Thickness | 1/2 oz, 1 oz, 2 oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin |
| Layer | 2-16 layers |
| Minimum Hole Size | 0.2 mm |
| Solder Mask Color | Green, Blue, Black, Red, Yellow, White |
| product name | HS-FR4 PCBA 001 |
| Brand Name | Hansion |
| Model Number | FR4 double side PCBA |
| Place of Origin | China |
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Product Specification
| Payment Terms | Western Union,T/T | Supply Ability | 10000PCS per month |
| Delivery Time | 3-5days | Packaging Details | foam+custom box |
| Silkscreen Color | White, Black, Yellow | Material | FR4 |
| Minimum Trace/Space | 4/4 mil | Copper Thickness | 1/2 oz, 1 oz, 2 oz |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver, Immersion Tin | Layer | 2-16 layers |
| Minimum Hole Size | 0.2 mm | Solder Mask Color | Green, Blue, Black, Red, Yellow, White |
| product name | HS-FR4 PCBA 001 | Brand Name | Hansion |
| Model Number | FR4 double side PCBA | Place of Origin | China |
| High Light | Customization Multilayer PCB Circuit Board ，High Density Interconnects PCB Circuit Board ，Customization multilayer pcb fabrication | ||
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Description
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Technology & Capabilities
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1. Product Range
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Rigid PCBs from 2- 24 layers, HDI; Aluminium base
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2. Min. Board Thickness
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2 layer
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4 layer
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6 layer
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8 layer
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10 layer
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min. 0.2 mm
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0.4 mm
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1 mm
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1.2 mm
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1.5 mm
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12 & 14 layer
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16 layer
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18 layer
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20 layer
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22 & 24 layer
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1.6 mm
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1.7 mm
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1.8 mm
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2.2 mm
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2.6 mm
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3. Max. Board Size
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610 x 1200 mm
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4. Base Material
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FR-4 Glass Epoxy laminate, Aluminium base, RCC
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5. Surface Finish Treatment
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Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic)
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6. Major Laminate
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King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others.
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7. Via Holes
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Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH
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8. Copper Foil Thickness
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18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz)
18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz)
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9. Min. Via Size and Type
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Dia. 0.15mm (Finished).
Aspect Ratiao = 12; HDI holes (＜0.10mm)
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10. Min. Line Width & Spacing
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0.75 mm/ 0.10mm ( 3mil/ 4mil)
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11. Min Via Hole Size & Pad
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Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI＜0.10mm via
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12. Impedance I Control Tol.
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+/- 10% ( min. +/- 7 Ohm)
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13. Solder Mask
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Liquid Photo- Image (LPI)
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14. Profiling
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CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering
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15. Capacity
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100 k㎡ output monthly
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FAQ:
Question 1.Are you pcba factory?
Answer:yes of course.
Question 2:Does your factory provide one stop service?
Answer:Yes of course we have purchase department and designer.
Question 4:can you provide me sample to test before mass order?
Answer:Yes of course
Question 5:how about your package?are you sure that i will receive the prefect goods without damage?
Answer:we provide custom foam box to protect the product.
Company Details
Business Type:
Manufacturer
Year Established:
2014
Total Annual:
7500000-9516000
Employee Number:
145~150
Ecer Certification：
Verified Supplier
Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe... Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe...
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