Changzhou Mingseal Robot Technology Co., Ltd.
| Payment Terms | L/C,D/A,D/P,T/T,Western Union |
| Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case |
| Applicable Process | Die Form Underfill |
| Electric Current | 30A |
| Power | 6.4KW |
| Warranty | 1 Year |
| Brand Name | Mingseal |
| Model Number | GS600SU |
| Certification | ISO |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union | Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case | Applicable Process | Die Form Underfill |
| Electric Current | 30A | Power | 6.4KW |
| Warranty | 1 Year | Brand Name | Mingseal |
| Model Number | GS600SU | Certification | ISO |
| Place of Origin | China | ||
| High Light | cnc glue dispenser iso ，cuf inline cnc glue dispenser ，fcbga automated glue dispenser | ||
FCBGA Packaging CUF Application Inline Jet Underfill Dispenser
The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine dispensing paths, and precise glue control are critical to yield and performance.
Built for high-reliability semiconductor production, the GS600 integrates an advanced piezo jetting module, real-time glue weight calibration, and a triple low-level alarm module—ensuring zero unexpected downtime in demanding mass production lines.
A key advantage for CPU packaging is the ability to strictly limit flow height to less than 70% of the chip’s sidewall while keeping keep-out zones (KOZ) under 250 μm. Combined with a precision visual alignment system and repeatable dot accuracy within ±25µm, the GS600 ensures minimal overflow and high fill uniformity.
Core Advantages
Typical Applications
✔ FCBGA (CPU) Underfill
✔ Flip Chip CPU Die Attach Protection
✔ High-Density BGA Packages
✔ Fine-Pitch Flip Chip Bonding
✔ Capillary Fill for High-Performance Microprocessors
Technical Specifications
|
Cleanliness Level |
Cleanliness of working area |
Class 100 (Class 1000 workshop ); Class 10 (Class 100 workshop) |
|
Transmission System |
Transmission System |
X/Y: Linear motor Z: Servo motor&Screw module |
|
Repeatability (3sigma) |
X/Y:±0.003mm Z:±0.005mm |
|
|
Positioning Accuracy (3sigma) |
X/Y:±0.010mm Z:±0.015mm |
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Max. Speed |
X/Y:1000mm/s |
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Z: 500mm/s |
||
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Max. Acceleration |
X/Y:1g Z:0.5g |
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|
Grating Resolution |
1 μm |
|
|
Z-Axis Range (W*D) |
350*470mm |
|
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Laser Sensor Accuracy |
2 μm |
|
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Jetting System |
Adhesive Control Precision |
±3%/1mg |
|
Single-dot Dispensing Position Repeatability |
±25 μ m |
|
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Min. Nozzle Diameter |
30 μ m |
|
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Min. Single-dot Weight |
0.001mg/dot |
|
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Max. Fluid Viscosity |
200000cps |
|
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Max. Jetting Frequency |
1000Hz |
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Fluid-box/Nozzle Heating Temperature |
Room Temperature~200℃ |
|
|
Fluid-box/Nozzle Heating Temperature Deviation |
±2℃ |
|
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Track System |
Max. Convey Speed |
300mm/s |
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Width Adjustment Range |
60-162mm |
|
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Max. Carrier Plate Thickness |
6mm |
|
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Max. Vacuum Suction Pressure |
-80KPa ~ -50KPa |
|
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Bottom Heating Temperature Range |
Room Temperature~150℃ |
|
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Bottom Heating Temperature Deviation |
±1.5℃ |
|
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Number of Tracks |
2 |
|
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General Condition |
Footprint W× D × H |
2380*1550*2080mm (With loading & Unloading and Screen Display) |
|
2380*1550*2080mm (With loading & Unloading, w/o Screen Display) |
||
|
Current |
30A |
|
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Power |
9.4kw |
|
|
Air Inlet |
(0.5Mpa, 450L/min)×2 |
FAQ
Q1: How does the GS600 control KOZ below 250μm?
A: Our proprietary path planning and flow control algorithms precisely confine glue spread, while high-resolution jetting and vision alignment minimize lateral flow beyond the intended area.
Q2: How do you ensure the flow does not climb too high?
A: By combining precision piezo jetting with advanced temperature control and bottom heating, the GS600 consistently limits the fill height to <70% of die height.
Q3: What about glue weight consistency?
A: Real-time inline glue weight inspection keeps glue output stable within ±3% while dot placement holds repeatability within ±25μm.
Q4: How is downtime minimized?
A: The GS600 includes a triple low-level alarm, integrated MES traceability, and smart syringe status detection, ensuring material runs are predictable and uninterrupted.
About Mingseal
As a trusted leader in high-precision dispensing, Mingseal provides cutting-edge inline and desktop systems for semiconductor, electronics, and precision optics industries. With deep process expertise, global support teams, and a commitment to smart manufacturing, we help advanced packaging factories achieve higher yield, lower cost, and stable quality—from CPU to SiP, BGA, and beyond.
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
10000000-50000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog... Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog...
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