Changzhou Mingseal Robot Technology Co., Ltd.
| Payment Terms | L/C,D/A,D/P,T/T,Western Union |
| Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case |
| Effective travel | 380*610mm |
| Weight | 1.5T |
| Electric Current: | 35A |
| Inhale | 5.0-7.0 kg / cm² |
| Brand Name | Mingseal |
| Model Number | GS600M |
| Certification | ISO CE |
| Place of Origin | China |
View Detail Information
Explore similar products
MEMS Microphone Automatic Glue Dispensing Machine Glue Dispensing Systems 220V
Optical Components Electronic Dispensing Machine 45mm Hot Melt Dispenser Machine
Automotive Electronics Automated Epoxy Dispenser Machine FPC Automatic Epoxy
LED MiniLED Display Electronic Dispensing Machine Automatic Glue Dispenser
Product Specification
| Payment Terms | L/C,D/A,D/P,T/T,Western Union | Delivery Time | 5-60 Days |
| Packaging Details | Wooden Case | Effective travel | 380*610mm |
| Weight | 1.5T | Electric Current: | 35A |
| Inhale | 5.0-7.0 kg / cm² | Brand Name | Mingseal |
| Model Number | GS600M | Certification | ISO CE |
| Place of Origin | China | ||
| High Light | 5.0kg/cm2 Inline Visual Electronic Dispensing Machine ，7.0kg/cm2 Electronic Dispensing Machine ，Wire Bonding auto glue dispenser | ||
Inline Visual Dispensing Machine for Wire Bonding Gold Wire Encapsulation
The GS600M Inline Visual Dispensing Machine is a precision-engineered inline dispensing solution designed to meet the ultra-high requirements of gold wire encapsulation in advanced wire bonding applications.
Equipped with a high-resolution visual alignment system, the GS600M detects fine wire positions and calculates optimal dispensing paths in real time. Its advanced low-level alarm module prevents unexpected interruptions by monitoring fluid levels and ensuring consistent glue supply throughout production.
The GS600M supports both single-valve micro-dispensing for precise adhesive control and double-valve configurations for higher throughput where needed. Its rigid mineral cast frame minimizes vibration, maintaining stable, consistent performance in high-volume wire bonding lines.
Key Advantages
Ultra-Precise KOZ Control: Guarantee accurate glue placement within a 10μm tolerance, safeguarding gold wire loops and preventing accidental bending or damage.
Consistent, Even Glue Dispensing: Advanced valve control and visual inspection ensure every encapsulation is uniform, preventing underfill or overflow that could compromise wire integrity.
Real-Time Visual Positioning: Integrated mark recognition and product appearance alignment enable adaptive path correction for complex wire patterns.
Low-Level Alarm Module: Proactively alerts operators when adhesive supply is low, minimizing downtime and avoiding incomplete encapsulations.
Typical Applications
✔ Gold Wire Encapsulation for Wire Bonding
✔ KOZ-Controlled Underfill for Semiconductor Packaging
✔ Fine-Pitch Die Attach Encapsulation
✔ ASIC and MEMS Chip Bonding Protection
✔ SMD Reinforcement and Potting
✔ Micro Sensor Wire Loop Protection
Key Specifications
|
Motion System |
Transmission System |
X/Y: Linear motor Z: Servo motor&Screw module |
|
Max. Dispensing Range |
X*Y: 280*170mm (Single track) --with loaing & unloading |
|
|
X*Y: 360*520mm/ 360*215mm (Single/ Double track) -- w/o loading & unloading |
||
|
Effective travel |
X*Y: 380*610mm |
|
|
Repeatability (3 sigma) |
X/Y≤±10μm, Z≤±10μm |
|
|
Positioning Accuracy |
X/Y≤±15μm, Z≤±15μm |
|
|
Max. Speed |
X/Y: 1300mm/s, Z: 500mm/s |
|
|
Max. Acceleration |
X/Y: 1.3g, Z: 0.5g |
|
|
Correction System |
Visual Positioning Method |
Mark/ Product Appearance |
|
Fly-align Positioning |
max: 300m/s |
|
|
Laser Altimetry |
Measurement Range: ±5 mm, Repeatability Accuracy 1μm, Sampling Frequency: 2k |
|
|
Track System |
Number of Tracks |
Single track / Double tracks |
|
Track Parallelism |
Widest to Narrowest: < 0.1 mm |
|
|
Width Adjustment Range |
40-170mm |
|
|
Side Pushing Accuracy |
≤0.02mm |
|
|
Loading & Unloading Module |
Suspended loop-type / Floor-standing loop-type loading & unloading, Touchable screen teaching |
FAQ
Q1: Why is KOZ control so critical for wire bonding?
A: Any glue overflow or misplacement can damage fine gold wires or cause electrical shorts. The GS600 series’s KOZ control ensures glue stays exactly where needed, protecting bond loops.
Q2: Can the GS600 series be used with UV-curable adhesives?
A: Yes. The system is compatible with a wide range of adhesives, including UV, epoxy, and underfill materials commonly used in semiconductor wire bonding.
Q3: Does the machine support high-mix production?
A: Absolutely. The system’s flexible configuration and recipe management allow fast model changeover, ideal for varied product runs.
Q4: How does it prevent whole line downtime?
A: Each track operates independently, and the conveyor track design separates maintenance areas — minimizing unplanned stops for the entire line.
Conclusion
Achieve unmatched precision, protect your gold wires, and meet the toughest encapsulation requirements — choose the GS600M for wire bonding encapsulation that sets your production apart.
Contact us for a custom demo and unlock next-level precision for your packaging line!
Company Details
Business Type:
Manufacturer
Year Established:
2008
Total Annual:
10000000-50000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog... Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog...
Get in touch with us
Leave a Message, we will call you back quickly!