Shenzhen Jiaqing Circuit Co., Ltd.
Products
Manufacturer of a wide range of products which include BT PCB,High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability,High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages,etc
MOQ: 1 PCS
Price: Price Negotiable
| Surface Finish | ENIG, ENEPIG, OSP |
| Rohs compliance | Yes |
| Solder mask color | Green / Blue / Red / Black / White |
| Payment Terms | L/C, D/A, D/P, T/T |
| Product name | IC Substrate Board |
| Minimum spacing | 2 mil (0.05mm) |
| Board size | Customizable up to 500mm x 500mm |
| Via type | Blind, Buried, Through-hole |
| Delivery Time | 5-15 working days, rush orders available |
| Layer Count | 2 – 18 layers |
| Minimum line width | 2 mil (0.05mm) |
| Via Diameter | 50 – 100 μm |
| Operating temperature | -40°C to 150°C |
| Core Thickness | 40 – 200 μm |
| Supply Ability | 20000 Sq.m / Month |
| Material | BT Resin / FR4 / Ceramic |
| Application | IC packaging, semiconductor devices |
| Packaging Details | Anti-static bag, vacuum packing with desiccant & humidity indicator card, packed in carton boxes |
| Surface finish | ENIG / HASL / OSP |
| Model Number | BT Resin PCB IC Substrate, BGA Packaging Substrate |
| Certification | ISO9001 |
| Brand Name | JQPCB |
| Place of Origin | China |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Delivery Time | 15-30 Days |
| Place of Origin | China |
| Certification | ISO9001 |
| Brand Name | Jiaqing Circuit |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Core Thickness | 40 – 200 μm |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Layer Count | 2 – 12 layers |
| Material | BT (Bismaleimide Triazine) resin |
| Delivery Time | 15-30 Days |
| Brand Name | Jiaqing Circuit |
| Certification | ISO9001 |
| Place of Origin | China |
MOQ:
Price: Negotiate
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Via Diameter | 50 – 100 μm |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Surface Finish | ENIG, ENEPIG, OSP |
| Delivery Time | 15-30 Days |
| Layer Count | 2 – 12 layers |
| Material | BT (Bismaleimide Triazine) resin |
| Payment Terms | L/C,D/A,D/P,T/T |
| Core Thickness | 40 – 200 μm |
| Place of Origin | China |
| Brand Name | Jiaqing Circuit |
| Certification | ISO9001 |
MOQ:
Price: Negotiate
| Core Thickness | 40 – 200 μm |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Layer Count | 2 – 12 layers |
| Payment Terms | L/C,D/A,D/P,T/T |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Material | BT (Bismaleimide Triazine) resin |
| Delivery Time | 15-30 Days |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Place of Origin | China |
| Certification | ISO9001 |
| Brand Name | Jiaqing Circuit |
MOQ:
Price: Negotiate
| Payment Terms | L/C,D/A,D/P,T/T |
| Line/Space Capability | 10/10 μm to 30/30 μm (SAP/MSAP) |
| Delivery Time | 15-30 Days |
| Glass Transition Temperature | 180°C – 225°C (DSC) |
| Layer Count | 2 – 12 layers |
| Via Diameter | 50 – 100 μm |
| Surface Finish | ENIG, ENEPIG, OSP |
| Core Thickness | 40 – 200 μm |
| Material | BT (Bismaleimide Triazine) resin |
| Brand Name | Jiaqing Circuit |
| Place of Origin | China |
| Certification | ISO9001 |
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