China factories

China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

Leave a Message

we will call you back quickly!

Submit Requirement
China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And
China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And

  1. China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And
  2. China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And
  3. China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And
  4. China 2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And

2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And

  1. MOQ: 1000 Pcs
  2. Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Place Of Origin Shenzhen, China
Packaging Details It Depends On The QTY Of Order And Size Of Product
Delivery Time 5~8 Working Days
Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per Day
Color Black (Customizable)
Size 2-inch (4-inch Optional)
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean Class General And Ultrasonic Cleaning
Capacity 11*8=88PCS
Warpage <0.2mm
Custom Logo Available
Brand Name Hiner-pack
Model Number HN24035
Certification ISO 9001 ROHS SGS

View Detail Information

Contact Now Ask for best deal
Get Latest Price Request a quote
  1. Product Details
  2. Company Details

Product Specification

Place Of Origin Shenzhen, China Packaging Details It Depends On The QTY Of Order And Size Of Product
Delivery Time 5~8 Working Days Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per Day Color Black (Customizable)
Size 2-inch (4-inch Optional) Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean Class General And Ultrasonic Cleaning Capacity 11*8=88PCS
Warpage <0.2mm Custom Logo Available
Brand Name Hiner-pack Model Number HN24035
Certification ISO 9001 ROHS SGS
High Light IC Chip Handling Small Tray4-inch IC Chip Tray2-inch IC Chip Tray

Small Tray For IC Chip Handling Across Packaging And Inspection

The Bare Die Tray (Chip Tray & Waffle Pack) series from  Hiner-pack provides a secure and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. The series offers products in various sizes and materials, ensuring flexibility to meet diverse needs. The product specifications include options for 2 inches and 4 inches in size.

The materials used for these trays include Antistatic/Conductive ABS and PC, which are known for their durability and protective properties. Customers can also request customized solutions tailored to their specific requirements, ensuring that the packaging meets their unique needs with precision and efficiency.

Features:

  • Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers;
  • Carbon-fiber reinforced for strength and permanent ESD protection;
  • Up to 180°C bake temperature available;
  • Industry-standard formats, customized for your needs.

Technical Parameters:

HN24035 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 11*8=88PCS 4.20*3.00*1.30mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D

Specifications:

The external dimensions of waffle pack chip trays are standard: 2-inch trays are two inches square, 4-inch trays are four inches square, and so on. The variability lies in the pocket size, geometry, and count.

Waffle pack trays are typically defined by several characteristics:

  • External size – 2”, 4”, etc.
  • Pocket size or pocket count – selecting one will determine the other
  • Temperature rating – the highest temperature at which the tray can be utilized

For custom waffle pack trays, additional specifications are required:

  • Component geometry
  • Special process requirements
  • Quantity of trays needed or quantity of components to be processed (which helps in selecting the appropriate manufacturing process for tray production)

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

+ Read More

Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

Leave a Message, we will call you back quickly!

Email

Check your email

Phone Number

Check your phone number

Requirement Details

Your message must be between 20-3,000 characters!

Submit Requirement