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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components
China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

  1. China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components
  2. China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components
  3. China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components
  4. China Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

  1. MOQ: 1000 Pcs
  2. Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
  3. Get Latest Price
Packaging Details It Depends On The QTY Of Order And Size Of Product
Delivery Time 5~8 Working Days
Payment Terms T/T
Supply Ability 4000PCS~5000PCS/per Day
Surface Resistance 1.0x10E4~1.0x10E11Ω
Injection Mold Lead Time 20~25 Days
Clean Class General And Ultrasonic Cleaning
Molding Method Injection Moulding
Property ESD
Anti-Static Yes
Stackable Yes
Customizable Yes
Brand Name Hiner-pack
Model Number HN24122
Certification ISO 9001 ROHS SGS
Place of Origin SHENZHEN CN

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details It Depends On The QTY Of Order And Size Of Product Delivery Time 5~8 Working Days
Payment Terms T/T Supply Ability 4000PCS~5000PCS/per Day
Surface Resistance 1.0x10E4~1.0x10E11Ω Injection Mold Lead Time 20~25 Days
Clean Class General And Ultrasonic Cleaning Molding Method Injection Moulding
Property ESD Anti-Static Yes
Stackable Yes Customizable Yes
Brand Name Hiner-pack Model Number HN24122
Certification ISO 9001 ROHS SGS Place of Origin SHENZHEN CN
High Light ESD Protection Bare Die TraysWaffle Box Design Bare Die Trays

Product Description:

Bare Die Trays are a preferred option due to their compact size. For small die, chip scale packages (CSP), and similar-sized components, when a full-size JEDEC matrix tray would be too bulky, bare die trays provide comparable industry acceptance and component protection in a more space-efficient form.

Bare die trays can be stacked to create protective compartments for your parts. Their small size makes them easy to package and transport efficiently.

These trays are favored for manual loading and unloading, and there are also commercial feeders available. In addition, we design JEDEC matrix trays that can function as "adaptors" for processing bare die trays through JEDEC tray feeders and handlers.

Features:

  • Trays are made from premium materials like conductive plastics and non-conductive polymers to prevent ESD damage and ensure durability, particularly safeguarding bare dies from common hazards in the semiconductor industry. Each tray is customized to specific dimensions to accommodate different bare die sizes.
  • The tray's pocket securely holds the dies in place, reducing the risk of motion or damage while in use.
  • Die trays are designed for a wide range of die sizes, from small microchips to large integrated circuits. Various tray designs cater to the diverse needs and innovative requirements in the industry.
  • Protective casings are crucial in semiconductor manufacturing and assembly processes, providing individual bare die protection during transportation or storage. They are also stackable to optimize space efficiency. Stacked trays can be conveniently stored in a corner, minimizing the risk of loss or misplacement.

Technical Parameters:

HN24122 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 15*18=270PCS 3.92*3.02*1.10mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: Chosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D

Customization:

Unlike standard bare die trays typically found in catalogs or on distributor shelves, we produce custom bare die trays tailored to the specific dimensions of your components. The trays are molded from materials chosen to meet your requirements and feature custom options like component support features, temperature rating, color choices, engraving, reference marks, and fiducial, as well as variations in size or thickness.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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