Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | SHENZHEN CN |
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Stacking Height | Customized |
| Service | Accept OEM,ODM |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Temperature | 80°C~180°C |
| Shape | Rectangular |
| Material | MPPO, PPE, ABS, PEI, IDP, Etc |
| Customized Service | Support Standard And Non-Standard,Precision Machining |
| Injection Mold | Customized Case Need (Lead Time 25~30 Days, Mold Life Span: 300,000 Times.) |
| Brand Name | Hiner-pack |
| Model Number | JEDEC TRAY SERIES |
| Certification | ISO 9001 ROHS SGS |
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Product Specification
| Place Of Origin | SHENZHEN CN | Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days | Payment Terms | T/T |
| Supply Ability | 2000PCS/Day | Stacking Height | Customized |
| Service | Accept OEM,ODM | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Temperature | 80°C~180°C | Shape | Rectangular |
| Material | MPPO, PPE, ABS, PEI, IDP, Etc | Customized Service | Support Standard And Non-Standard,Precision Machining |
| Injection Mold | Customized Case Need (Lead Time 25~30 Days, Mold Life Span: 300,000 Times.) | Brand Name | Hiner-pack |
| Model Number | JEDEC TRAY SERIES | Certification | ISO 9001 ROHS SGS |
| High Light | Electronics Parts Packing Custom JEDEC Trays ，Injection Mold Custom JEDEC Trays ，Chemical Resistance Custom JEDEC Trays | ||
The outline dimensions of all JEDEC matrix trays are 12.7 x 5.35 inches (322.6 x 136mm). Low profile trays with thickness of 0.25-inch (6.35mm) accommodate 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC. A high profile 0.40-inch (10.16mm) version is available to hold thick (high) components such as PLCC, CERQUAD, PGA (Pin Grid Arrays), modules and assemblies.
A lot of thought was put into the design of JEDEC trays. Trays are configured with flat cells in the center area to allow automated handing by vacuum pick up tools. A scalloped feature is sculpted into one side of the tray to allow the use of a pin to mechanically fix correct orientation during use. A 45-degree chamfer in one corner provides a visual indicator of Pin 1 orientation of the components mounted in the tray.
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24037 | Cavity Size | 11*7*1.3mm |
| Package Type | IC Component | Matrix QTY | 12*20=240PCS |
| Material | MPPO | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
• Packaging – at their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
• Transportation & Storage – parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.
• Protection – JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage
• Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for JEDEC trays are widespread and global. This includes corrugated boxes, protective covers, retaining straps, modular feeders, and a wealth of industry knowledge.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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