Shenzhen Hiner Technology Co.,LTD
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） |
| Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | T/T |
| Supply Ability | 2000PCS/Day |
| Property | ESD, Non-ESD |
| Temperature Resistance | Up To 150°C Or More High |
| Service | Accept OEM,ODM |
| Stackable | Yes |
| Color | Black |
| Cavity Dimensions | Customized |
| Custom Logo | Available |
| Type | BGA IC |
| Brand Name | Hiner-pack |
| Model Number | JEDEC TRAY SERIES |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CN |
View Detail Information
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Product Specification
| Packaging Details | 70~100pcs/carton(According To The Customer Demand） | Delivery Time | Mold：About 25 Days / Product：7~10 Days |
| Payment Terms | T/T | Supply Ability | 2000PCS/Day |
| Property | ESD, Non-ESD | Temperature Resistance | Up To 150°C Or More High |
| Service | Accept OEM,ODM | Stackable | Yes |
| Color | Black | Cavity Dimensions | Customized |
| Custom Logo | Available | Type | BGA IC |
| Brand Name | Hiner-pack | Model Number | JEDEC TRAY SERIES |
| Certification | ISO 9001 ROHS SGS | Place of Origin | SHENZHEN CN |
| High Light | High Precision Custom JEDEC Trays ，High Capacity Custom JEDEC Trays ，Electronics Parts Packing Custom JEDEC Trays | ||
High Capacity Custom JEDEC Trays With High-Precision For Electronics Parts Packing
JEDEC trays are also known as "matrix" trays since the components are nested into pockets in fixed-position rows and columns. The spacing (pitch) of each component pocket (cells) is defined by JEDEC standards. This allows automated pick and place machines to dimensionally locate and pick up the components from the tray and place onto a PC board. JEDEC trays are also required by industries outside of traditional electronics. The solar photovoltaic industry as well as the medical industry is enjoying benefits by using JEDEC trays during storage, handling and transport of devices specific to their industries.
1. Ten years of experience in the ESD tray Field;
2. Adequate Supply of products;
3. Professional non-standard custom;
4. MPPO.PPE.ABS.PEI.IDP...etc material;
5. Products follow the JEDEC antistatic standard;
6. The tray is permanent, unitary antistatic, cutting off the headstream of the static threat of the products.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN24012 | Cavity Size | 25*31*2.91mm |
| Package Type | IC Component | Matrix QTY | 10*3=30PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Q: How can I get a quotation?
A: Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
Q: How long will it take to get a response?
A:We will reply to you within 24 hours of working day.
Q: What kind of service we provide?
A:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
Q: What is your terms of delivery?
A:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
Q: How to guarantee quality?
A:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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