Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Matrix QTY | 18*15-16=254PCS |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN21131 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Matrix QTY | 18*15-16=254PCS | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding | Brand Name | Hiner-pack |
| Model Number | HN21131 | Certification | ISO 9001 ROHS SGS |
| Place of Origin | CHINA | ||
| High Light | Injection Moulding Waffle Packs Tray ，PC Material Waffle Pack Tray ，LED Chips Waffle Pack Tray | ||
Waffle Pack Chip Tray Series For LED Chips Packaging Solution
To protect IC or conponents during shipments, It is critically important to choose the right supply form and packaging.Movement of the product within the container, contact with upper surfaces, electrostatic discharge (ESD), or exposure to air can damage the product.
Hiner-pack offers a wide selections of products to meet your specific bare die, chip scale, package shipping and handling needs. As packaging experts, we can help you choose the waffle pack that best meets your manufacturing needs while protecting your bare die from corrosion and ESD.
Details Of HN21131 Chip Tray
The HN21131 waffle pack is mainly made of PC. The material has good stability and can protect customers' electronic products well. The matrix design of 18*15-16 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of products and saving shipping costs.
| Outline Line Size | 50*50*4.5mm | Brand | Hiner-pack |
| Model | HN21131 | Package Type | Die |
| Cavity Size | 1.4*1.8*0.9 | Matrix QTY | 18*15-16=254PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application Of HN21131 Chip Tray
Electronic Components Semiconductor
Embedded System Micro and Anon System
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Advantages
1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3. Can I order if quantity less than MOQ?
Ans:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q4. Can I get Free Samples?
Ans:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required.
Q5: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.
Q6. Do you arrange shipment for the products?
Ans:It’s depends on our incoterms.If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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