Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | PC |
| Color | Black |
| Property | ESD |
| Design | Standard |
| Size | 4 Inch |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Injection Mold | Lead Time 20~25Days, Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | HN2009 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | PC | Color | Black |
| Property | ESD | Design | Standard |
| Size | 4 Inch | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Incoterms | EXW, FOB, CIF, DDU, DDP |
| Injection Mold | Lead Time 20~25Days, Mold Life Span: 30~450,000 Times | Molding Method | Injection Moulding |
| Brand Name | Hiner-pack | Model Number | HN2009 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | ESD Waffle Tray Packaging ，SGS Waffle Tray Packaging ，Waffle conductive tray | ||
Deliver clean, organized, and damage-free chips to your customers with our custom-designed IC chip trays.
General anti-static trays are designed and made according to the size provided by customers to achieve the most reasonable loading, and multiple trays can be overlapped to effectively use the plant space, increase the storage capacity of electronic components, PCB boards, and dust-free workshop components, and save production costs.
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized. Provide one-stop service from design to production to packaging.
1. More than 12 years of export experience.
2. With professional engineers and efficient management.
3. Short delivery time and good quality.
4. Support small batch production in the first batch.
5. Professional sales within 24 hours efficient reply.
6. The Factory has ISO certification, and the products comply to RoHS standard.
7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized.
Wafer Die / Bar / Chips; PCBA module component; Electronic component packaging; Optical device packaging
| Brand | Hiner-pack | Outline Line Size | 101.6*101.6*5.0mm |
| Model | HN2009 | Cavity Size | 3.7*2.4*1.45mm |
| Package Type | IC Parts | Matrix QTY | 18*21=378PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Q1: Are You a Manufacturer or a Trade Company?
We are a 100% Manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What is the material of your product?
ABS, PC, PPE, MPPO, PEI, HIPS, etc.
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirements.
Q4: How can I get the quotation for the custom products?
Let us know the size of your IC or component thickness, and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the free sample in stock can be sent, but the shipping fee should be paid by you.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send them right now if you are interested in something we have in stock, and customize the project depends on the specific time.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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