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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components
China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components

  1. China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components
  2. China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components
  3. China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components
  4. China Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components

Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components

  1. MOQ: 1000 pcs
  2. Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
  3. Get Latest Price
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc
Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD
Design Standard and Non-standard
Size All kinds of
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Brand Name Hiner-pack
Model Number To meet all kinds of custom needs of customers
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days Packaging Details It depends on the QTY of order and size of product
Material ABS.PC.PPE.MPPO...etc Color Black.Red.Yellow.Green.White..etc
Property ESD,Non-ESD Design Standard and Non-standard
Size All kinds of Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method Injection Moulding
Brand Name Hiner-pack Model Number To meet all kinds of custom needs of customers
Certification ISO 9001 ROHS SGS Place of Origin Made In China
High Light 400PCS IC Chip TrayISO9001 IC Chip Tray400PCS Electronic Components Tray

Custom Size Black IC Chip Tray 400PCS For Packaging Electronic Components

 

Manufacturer Designs Custom IC Trays For Packaging Electronic Components

 

Hiner-pack has leading mould processing and injection molding equipment,high level dustless cleaning devices and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as researching institutions.Hiner-pack has mastered special process technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products,constantly launch new products,and solve the customers’ demand for high quality products.

 

Advantages


1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement

 

Ref Detail

Outline Line Size 50.7*50.7*4mm Brand Hiner-pack
Model 30*30-10 Package Type IC Die
Cavity Size 0.76*0.76*0.254mm Matrix QTY 20*20=400PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS
Usage Packaging of Electronic Components,Optical device,
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material MPPO.PPE.ABS.PEI.IDP...etc
Color Black.Red.Yellow.Green.White and custom color
Size Customized size, rectangle,circle shape
Mold type Injection Mold
Design Original sample or we can create the designs
Packing By Carton
Sample Sample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should according to the ordered quantity

FAQ

 

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize

the project depending on the specific time

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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