Shenzhen Hiner Technology Co.,LTD
| Payment Terms | T/T |
| Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days |
| Packaging Details | It depends on the QTY of order and size of product |
| Material | ABS.PC.PPE.MPPO...etc |
| Color | Black.Red.Yellow.Green.White..etc |
| Property | ESD,Non-ESD |
| Design | Standard and Non-standard |
| Size | All kinds of |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning |
| Incoterms | EXW,FOB,CIF,DDU,DDP |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times |
| Molding Method | Injection Moulding |
| Brand Name | Hiner-pack |
| Model Number | To meet all kinds of custom needs of customers |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | Made In China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | The capacity is between 4000PCS~5000PCS/per day |
| Delivery Time | 5~8 working days | Packaging Details | It depends on the QTY of order and size of product |
| Material | ABS.PC.PPE.MPPO...etc | Color | Black.Red.Yellow.Green.White..etc |
| Property | ESD,Non-ESD | Design | Standard and Non-standard |
| Size | All kinds of | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Clean class | General And Ultrasonic Cleaning | Incoterms | EXW,FOB,CIF,DDU,DDP |
| Injection Mold | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method | Injection Moulding |
| Brand Name | Hiner-pack | Model Number | To meet all kinds of custom needs of customers |
| Certification | ISO 9001 ROHS SGS | Place of Origin | Made In China |
| High Light | ESD Bare Die Trays ，ROHS Bare Die Trays ，MPPO Bare Die Tray | ||
Heat Resistant ESD Bare Die Trays
Heat Resistant ESD IC Tray Made From Injection Moulds Can Carry Bare Die
Hiner offer the ultimate protection and convenience. We offer a wide variety of matrix trays to satisfy the most demanding requirements of today's automatic test and handling environments. While international standards provide compatibility with process equipment, every device and component has its own requirements for tray pocket details.
Hiner pack designs trays for any type of component, module, MEMS, or device, and it need not be in a JEDEC format. Working with application requirements, engineering principles, materials technology, and manufacturing best practices, a custom solution may be the best value for your business.
Custom molded tray will develop a custom pocket design to handle and protect your sensitive and micro devices. Trays are then CNC machined to the specific configuration for your part.
Our Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the quality concerns of customers before quantity
Advantages
1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improve the storage time of components;
5. No extrusion and breakage, Better protection components；
6. Reusable, quality assurance.
Application of ESD Tray
1. Packing Material: Instead of the traditional packing material such as corrugated paper, wood board, it can be designed as all kinds of turnover box, mailbox, , partition, gift boxes,display rack,food packing,etc.
2. Electronic component factories
3. SMT Surfacing factories
4. Semiconductor
5. Aerospace industry
6. Military Industry
| Outline Line Size | 101.6*101.6*4.5 | Brand | Hiner-pack |
| Model | HN1956 | Package Type | IC |
| Cavity Size | 14*4*0.32mm | Matrix QTY | 30*5=150PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Temperature | 100°C |
| Resistance | 1.0x10e4-1.0x10e11Ω | Service | Accept OEM,ODM |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
FAQ
Q1. Why Choose us?
Wallis insist strict QC during producing, product performance are ensured.
Strong technical team-quick to solve problems, creative to design new items, latest RFID items .
Big capacity-cost-effective and flexible to adjust production for volume and urgent orders.
10-year factory experienced in all crafts, and with strong customization capacity, satisfy your requirement to the best.
Having long-term and stable material suppliers, sources are trust-able and time-effective.
Owning professional agents of shipping. Goods reach to you fast, save and cost-effective.
Q2. Can I order if quantity less than MOQ?
Yes and it would be taken as sample order to production. We take more serious on sample order.
Q3. Can I get Free Samples?
Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.
Q4. Do you arrange shipment for the products?
It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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