Beijing Plink AI Technology Co., Ltd
| Payment Terms | L/C, D/A, D/P, T/T |
| Supply Ability | 1+set+4weeks |
| Delivery Time | 15-30 work days |
| Packaging Details | 120mm x 120mm x 75mm |
| NAME | Driverless INT8 Nvidia AI Jetson Agx Developer Kit Embedded System 32GB |
| Keyword | Driverless INT8 Nvidia AI Jetson Agx Developer Kit Embedded System 32GB |
| Adaptation core | Jetson AGX Orin |
| AI Performance | 275 TOPS |
| Memory | 32GB 256-bit LPDDR5 204.8GB/s |
| Storage | 64GB eMMC 5.1 |
| Power | 15W | 30W | 50W |
| DLA Max Frequency | 1.6 GHz |
| Single package size | 120mm x 120mm x 75mm |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
| Brand Name | NVIDIA |
| Model Number | Jetson AGX Orin Developer Kit |
| Place of Origin | USA |
View Detail Information
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Product Specification
| Payment Terms | L/C, D/A, D/P, T/T | Supply Ability | 1+set+4weeks |
| Delivery Time | 15-30 work days | Packaging Details | 120mm x 120mm x 75mm |
| NAME | Driverless INT8 Nvidia AI Jetson Agx Developer Kit Embedded System 32GB | Keyword | Driverless INT8 Nvidia AI Jetson Agx Developer Kit Embedded System 32GB |
| Adaptation core | Jetson AGX Orin | AI Performance | 275 TOPS |
| Memory | 32GB 256-bit LPDDR5 204.8GB/s | Storage | 64GB eMMC 5.1 |
| Power | 15W | 30W | 50W | DLA Max Frequency | 1.6 GHz |
| Single package size | 120mm x 120mm x 75mm | CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| Mechanical | 100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate | Brand Name | NVIDIA |
| Model Number | Jetson AGX Orin Developer Kit | Place of Origin | USA |
| High Light | 32GB jetson agx developer kit ，INT8 jetson agx developer kit ，INT8 nvidia ai development kit | ||
Driverless INT8 Nvidia AI Jetson Agx Developer Kit Embedded System 32GB
NVIDIA Jetson AGX Orin Developer Kit
NVIDIA Jetson AGX Orin Developer Kit enables development of full-featured AI applications for products based on Jetson Orin modules. It includes a high-performance, power-efficient Jetson AGX Orin module, and can emulate the other Jetson Orin modules.
NVIDIA Jetson AGX Orin is the most powerful AI edge computer, delivering up to 275 TOPS of AI performance for powering autonomous systems. This power-efficient system-on-module is form factor and pin-compatible with Jetson AGX Xavier and offers up to 6x AI performance. This system-on-module (SOM) features the NVIDIA Orin SoC with a NVIDIA Ampere architecture GPU, Arm® Cortex®-A78AE CPU, next-generation deep learning and vision accelerators, and a video encoder and a video decoder. High speed IO, 204 GB/s of memory bandwidth, and 32 GB of DRAM enable the module to feed multiple concurrent AI application pipelines. With the SOM design, NVIDIA has done the heavy lifting of designing around the chip and providing not only the compute and I/O but also the power and memory design.
Jetson AGX Orin Technical Specifications
| AI Performance | 275 TOPS (INT8) |
| GPU | NVIDIA Ampere architecture |
| Max GPU Freq | 1 GHz |
| CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
| CPU Max Freq | 2 GHz |
| DL Accelerator | 2x NVDLA v2.0 |
| Vision Accelerator | PVA v2.0 |
| Memory | 32GB 256-bit LPDDR5 204.8 GB/s |
| Storage | 64GB eMMC 5.1 |
| CSI Camera | Up to 6 cameras (16 via virtual channels*) |
| Video Encode | 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) |
| Video Decode | 1x 8K30 | 3x 4K60 | 6x 4K30 | 12x 1080p60 | 24x 1080p30 (H.265) |
| UPHY | 2 x8 (or 1x8 + 2x4), 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint) Single-lane UFS |
| Networking | 1x GbE |
| Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 |
| Other I/O | 4x USB 2.0 |
| Power | 15W | 30W | 50W |
| Mechanical | 100mm x 87mm |
*Virtual Channel related camera information for Jetson AGX Orin is not final and subject to change.
** Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features
Included in the Box
Your Jetson AGX Orin Developer Kit includes:
NVIDIA Jetson AGX module with heat sink and reference carrier board
802.11ac/abgn wireless Network Interface Controller
USB Type-C power supply
USB Type-C to USB Type-A cable
Quick Start and Support Guide
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2009
Total Annual:
1500000-2000000
Employee Number:
10~30
Ecer Certification：
Active Member
Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ... Beijing Plink-Ai is a high-tech company integrating research and development, production and sales and one of the industry and civil intelligence device wholly solution supplier. Founded in 2009, Beijing Plink-AI always persists on ‘creation+efficiency+Intelligence’ core theory, focuses ...
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