Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability | 10000pcs |
Delivery Time | 1-3 WORKING DAYS |
Packaging Details | standard packing as your request ,ESD/Vacuum/Foam/Cartons |
Description | TriCore ™ - Microcontroller IC 32-bit Triple Core 200MHz 4MB (4M x 8) Flash PG-LQFP-176-22 |
Stock | 50000pcs |
Shipping Method | LCL, AIR, FCL, Express |
Model | SAK-TC275TF-64F200N DC |
working temperature | -40°C ~ 125°C(TA) |
Mounting Type | SMT/SMD |
Applications | PCBA |
Shipping | DHL\UPS\Fedex\EMS\HK Post |
Payment | Paypal\TT\Western Union\Trade Assurance |
Sample | Supplied |
Peripherals | DMA, POR, WDT |
Brand Name | infineon |
Model Number | SAK-TC275TF-64F200N DC |
Certification | SGS.TCT. |
Place of Origin | Original Brand |
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Product Specification
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram | Supply Ability | 10000pcs |
Delivery Time | 1-3 WORKING DAYS | Packaging Details | standard packing as your request ,ESD/Vacuum/Foam/Cartons |
Description | TriCore ™ - Microcontroller IC 32-bit Triple Core 200MHz 4MB (4M x 8) Flash PG-LQFP-176-22 | Stock | 50000pcs |
Shipping Method | LCL, AIR, FCL, Express | Model | SAK-TC275TF-64F200N DC |
working temperature | -40°C ~ 125°C(TA) | Mounting Type | SMT/SMD |
Applications | PCBA | Shipping | DHL\UPS\Fedex\EMS\HK Post |
Payment | Paypal\TT\Western Union\Trade Assurance | Sample | Supplied |
Peripherals | DMA, POR, WDT | Brand Name | infineon |
Model Number | SAK-TC275TF-64F200N DC | Certification | SGS.TCT. |
Place of Origin | Original Brand | ||
High Light | MCU Common Integrated Circuits ,2.5MB FLASH Common Integrated Circuits ,SAK-TC275TF-64F200N DC |
SAK-TC275TF-64F200N DC
Products Description:
1.1 Scope This manual defines the Embedded Applications Binary Interface (EABI) for Infineon Technologies TriCore™ 32- bit Unified microprocessor architecture. The EABI is a set of interface standards that writers of compilers and assemblers and linker/locators must use when creating compliant tools for the TriCore architecture. These standards cover run-time aspects as well as object formats to be used by compatible tool chains. A standard definition ensures that all TriCore tools are compatible and can interoperate at the binary object level. Note: Source code compatibility and assembly language compatibility are separate issues which are not covered by this document.
1.2 Purpose The standards defined in this manual ensure that all conforming chains of development tools for TriCore will be compatible at the binary object level. Compatible tools can interoperate and therefore make it possible to select an optimum tool for each link in the chain, rather than selecting an entire chain on the basis of overall performance. The standards in this manual also ensure that compatible libraries of binary components can be created and maintained. Such libraries make it possible for developers to synthesize applications from binary components, and can make libraries of common services stored in on-chip ROM available to applications executing from off-chip memory. With established standards, developers can build up libraries over time with the assurance of continued compatibility.
1.3 Overview Standards in this manual are intended to enable creation of compatible development tools for the TriCore, by defining minimum standards for compatibility between: • Object modules generated by different tool chains • Object modules and the TriCore processor • Object modules and source level debugging tools These standards do not entirely disallow vendor-specific extensions and feature enhancements aimed at differentiating a vendor’s product. However, to claim compliance with this manual, a tool set must support an “EABI compliance mode”, in which any incompatible extensions are suppressed. “Incompatible extensions” are defined as those that, if used, would prevent the object module output of the tool chain from being linked in and used by applications compiled with tool chains supporting only the standards defined herein. Current definitions include the following types of standards: • Low-Level Run-Time Binary Interface Standards • Object File Binary Interface Standards • Naming Conventions
Technological Parameters:
category | Integrated Circuit (IC) |
manufacturer | Infineon Technologies |
Core processor | TriCore™ |
Kernel specifications | 32-bit dual core |
speed | 200MHz |
Connectivity | ASC,CANbus,Ethernet,FlexRay,HSSL,I²C,LIN,MSC,PSI5,QSPI,SENT |
peripheral | DMA,WDT |
I/O count | 88 |
Program storage capacity | 2.5MB(2.5M x 8) |
Program Memory Type | flash memory |
EEPROM capacity | 96K x 8 |
RAM size | 752K x 8 |
Voltage Supply (Vcc/Vdd) | 1.17V ~ 5.5V |
converter | A/D 40x12b SAR, Trigonometric integral |
Oscillator Type | external |
operation temperature | -40°C ~ 125°C(TA) |
Supplier Device Packaging | PG-LQFP-144-22 |
Customer Service:
1. Do you support BOM lists?
Of course, we have a professional team to provide BOM.
2. Shown below. Behind MOQ?
Our MOQ is flexible and can be provided according to your needs, with a minimum of 10 pieces.
3. What about lead time?
After receiving the deposit, we will arrange to pack the goods and contact logistics for delivery. The duration is 3-7 days.
4. Our advantage?
1. Stable and sufficient supply
2. Competitive pricing
3. Rich BOM experience
4. Perfect after-sales service
5. Professional test certificate
5. Our service?
Payment methods :T/T, L/C, D/P, D/A, MoneyGram, Credit Card, paypal, Western Union, Cash, Escrow, Alipay...
6. Transportation:
DHL, TNT, FedEx, EMS, DEPX, Air, Sea Shipping
Product Photos:
Company Details
Business Type:
Distributor/Wholesaler,Agent,Seller
Year Established:
2018
Total Annual:
2000000-400000000
Employee Number:
80~100
Ecer Certification:
Site Member
Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ... Dingcen International (Hong Kong) Co., Ltd. specializes in the IC series products, which are widely used in various fields such as aerospace, communication, Internet of Things, automotive electronics, electronic equipment, instrumentation, security and fire protection, medical equipment, etc. We ...
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