YS-8500 Is High Efficiency Industrial X-Ray Microfocus CT Equipment,image

Product Specification

Standard Configuration:

1.COMET Y.FXE microfocal X-ray source: FXE- 160.50, with TXI function, penetrating X-ray tube head

2.HD image processing system: amorphous silicon high- speed flat digital detector 0505J, 16 bit A/D conversion

3.X-Y axis sample platform, lead screw drive  

4.X-ray tube Z-axis electric motion axis  

5. Rocker control system

6.CNC programming function with built-in AXI function, quickly completing the detection of multiple samples arranged in a matrix

7.64 bit Windows 10 operating system, 27 'TFT display

8.Standard maintenance toolbox

9.Super large Automatic door

10.Detector Z-axis and tilt rotation motion axis

Configuration Instructions:

1.Microfocus open X-ray tube: FXE- 16 0.5 0 , penetrating X-ray tube head, high voltage adjustment range: 20~ 160KV, maximum tube current 1000µA, maximum tube power 64W, maximum target power 15W, high-power target, beam angle 170°, minimum focus to object distance (FOD)<300um, minimum focus<2um, minimum defect detection ability<950nm (JIMA RT RC- 02B line pair card verification);

2.Non crystalline silicon high-definition digital flat panel detector: 130mm x 130mm, pixels: 1536x1536, pixel size: 85um, image frame rate ( 1×1) : 20fps, A/D conversion: 16 bits;

3.Minimum focus to detector distance: 50mm, minimum focus to object distance: 0.25mm, geometric magnification 2000 times;

4.6-axis motion: X and Y motion of the stage, up and down, tilt (65 °) and rotation motion of the detector, and up and down motion of the ray tube;

5.The maximum sample size is 645m x 635 mm, the maximum detection area is 500mm x 500mm, the maximum movement distance of the detector is 500mm, and the maximum movement distance of the ray tube is 200mm;

6.Maximum sample weight 5kgs;

7.I7-7700K 16GB memory 1T SSD Solid-state drive SUPER E-sports 8G seven rainbow graphics card WIN10 professional CPU;

8.Equipment size: L1500mm x W1650mm × H2250mm, weight approximately 2800kgs.

Extended Configuration:

1 . Image Enhancement :

Frame superposition, image noise removal, Edge enhancement and other technologies are used to adjust the contrast and brightness of the image, so that the contour lines of the image (sample) are obvious, and the structure and level information of the image (sample) can be clearly reflected. An algorithm used to improve image clarity.

2. Manual measurement and manual bubble (voids) measurement:

Based on the static image of the inspection sample, manual measurement can achieve measurement of actual length (distance), area, curvature, solder crawling rate, angle, circle, etc. It can also measure the bubbles ( voids) of solder pads such as chips, BGA, LED, etc., and calculate the proportion of bubbles (voids).

3 . Advanced automatic voids measurement:

For batch measurement scenarios, according to the pre-set detection template, the CNC automatic detection function is used to automatically collect images, call the detection template to calculate the proportion of bubbles ( voids), and compare it with the pre-set judgment threshold to output the judgment result (OK/NG).

4 . Automatic center-following motion:

Unique X - ray tube and detector synchronous motion technology ensures that the detected point is at the center of the image.

5 . Navigation automatic puzzle function:

Splice the X-ray perspective images of each scanning area of the inspection sample according to their corresponding positions to form an overall image, and use this image as a navigation map to automatically label the test results on the navigation map, including: pass, fail, and need further inspection if in doubt.

6 . Automatically generate inspection reports:

The inspection report provides historical traceability of sample inspection, and the measurement (distance, voids, etc.) results are automatically output to form a report (or data table). The report includes shooting conditions, physical images, inspection images, inspection data, and judgment results.

7 . Barcode scanning (Optional ) :

Scan the barcode information of the test sample and associate this information with the test images and data for traceability inspection of the test results.

8 . CNC automatic inspection function :

According to the inspection requirements, preset the inspection program (including inspection location information, radiation conditions, automatic inspection templates, etc.) to achieve automatic inspection, and GOOD/ NG judgment functions, and output a schematic diagram of the inspection results for easy re-confirmation of the inspection results and screening of defective products.

9 . System information docking function :

Support MES docking ( customized according to customer projects) , upload device status, CNC automatic detection results ( including images) , and corresponding shooting parameter conditions and other data.

1 0 . CT scanning and analysis function:

VGSTUDIO 2023. 1 VGSTUDIO Basic Edition 1 set, single user, dongle license, one-year upgrade/service. Used for analyzing and displaying volume data, combined with the following related reconstruction modules and iterative artifact techniques, to achieve the following functions: ( 1 ) 3D visualization; (2) Data quality analysis based on ASTM E 1695 standard, continuously monitoring the quality of CT scanning data. ( 3 ) Dataset alignment: Simple 3-2- 1 alignment and simple alignment. (4) Distance, line length, and angle measurement tools. ( 5 ) Report: Use export and report functions and save the results in VG report format (. vgrf) or as a custom test report, such as an .xlsx or .pdf file.