Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
| Payment Terms | L/C,T/T |
| Supply Ability | Negotiation |
| Delivery Time | Negotiation |
| Packaging Details | Standard Packing |
| Color | Transparent |
| Elongation At Break | 150% |
| Tensile Strength | 50 MPa |
| Width | 100mm |
| Thickness | 0.05mm |
| Surface Finish | Glossy |
| Adhesive Type | Acrylic |
| Chemical Resistance | Excellent |
| Dielectric Strength | 500 V/mil |
| Material | Polyester |
| Temperature Resistance | Up to 150°C |
| Flame Retardant | UL94 V-0 |
| Brand Name | Guofeng |
| Model Number | 7.5um |
| Certification | UL ISO ROHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | L/C,T/T | Supply Ability | Negotiation |
| Delivery Time | Negotiation | Packaging Details | Standard Packing |
| Color | Transparent | Elongation At Break | 150% |
| Tensile Strength | 50 MPa | Width | 100mm |
| Thickness | 0.05mm | Surface Finish | Glossy |
| Adhesive Type | Acrylic | Chemical Resistance | Excellent |
| Dielectric Strength | 500 V/mil | Material | Polyester |
| Temperature Resistance | Up to 150°C | Flame Retardant | UL94 V-0 |
| Brand Name | Guofeng | Model Number | 7.5um |
| Certification | UL ISO ROHS | Place of Origin | China |
| High Light | Multilayer FPC Film ，odm FPC Film ，electrical polyimide insulation tape | ||
This advanced polyimide coverlay film represents a breakthrough in circuit protection technology, combining a ultra-thin polyimide core (8-25μm) with functional adhesive layers to provide comprehensive protection for high-density circuits. Featuring 50% better flexibility and 40% higher temperature resistance than standard coverlay films, it offers superior solder mask replacement capability while ensuring long-term reliability in demanding applications. The material's unique multi-layer construction provides simultaneous electrical insulation, mechanical protection, and environmental sealing for next-generation electronics.
Exceptional Thin-Film Performance
Ultra-thin construction (8-25μm) enables bending radii down to 0.1mm
60% improvement in flexibility compared to standard coverlay films
Maintains integrity through 100,000+ dynamic flex cycles
Advanced Thermal Management
Withstands 10× reflow cycles at 260°C without degradation
Continuous service temperature from -269°C to 280°C
Thermal conductivity 0.8 W/m·K (3× conventional coverlay materials)
Superior Protection Properties
Dielectric strength >6.5 kV/mm for reliable electrical isolation
Chemical resistance to fluxes, solvents, and cleaning agents
Moisture absorption <0.3% (50% lower than standard films)
Enhanced Processing Characteristics
Laser drillable with 15μm via capability for fine-pitch components
Excellent dimensional stability (±0.05%) during lamination processes
Compatible with automated application equipment for high-volume production
High-Density Flexible Circuits
Solder mask replacement for fine-pitch BGA and CSP components
Protection layer for ultra-thin flexible printed circuits
Coverlay for rigid-flex board transition areas
Advanced Electronics Packaging
Semiconductor device protection and insulation
MEMS and sensor packaging encapsulation
RF/microwave circuit shielding and protection
Demanding Environment Applications
Automotive electronics under-hood protection
Aerospace and defense circuit protection systems
Medical implantable device encapsulation
Consumer Electronics
Wearable device circuit protection
Foldable display circuit insulation
High-reliability mobile device circuitry
GB-Type Polyimide Black Film offers excellent thermal stability, electrical insulation, and dimensional reliability. With its opaque black appearance, it is widely used in electronics, flexible circuits, and semiconductor packaging, providing both performance and light-blocking protection.
This coverlay film system redefines circuit protection standards by combining ultra-thin flexibility with robust environmental protection. Unlike conventional solder masks that crack under stress or standard coverlay films that lack precision processing capabilities, this multi-layer system provides complete protection while maintaining the flexibility needed for modern high-density circuit designs. The material's exceptional thermal and chemical resistance ensures reliable performance in the most demanding applications, from automotive under-hood environments to implantable medical devices.
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
Company Details
Business Type:
Manufacturer
Year Established:
2021
Total Annual:
28000-50000
Employee Number:
100~300
Ecer Certification：
Verified Supplier
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl... Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl...
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