Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
| Payment Terms | L/C,T/T |
| Supply Ability | Negotiation |
| Delivery Time | Negotiation |
| Packaging Details | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Film Appearance | The substrate must maintain nanometer-level planarity while demonstrating complete absence of topological defects, particulate inclusions, polymeric agglomerations, or extraneous contamination across its entire functional area. |
| Film Thickness | 25μm |
| Film Tensile Strengthh | 480MPa |
| Film Elongation at break | 40% |
| Film Young's Modulus | 7GPa |
| Film Insulation Strength | 350V/μm |
| Film Moisture absorption | 1425Kg/m³ |
| Film Thermal Shrinkage(200°，2h) | 0.04% |
| Film Linear expansion coefficient | 8ppm |
| Film Moisture absorption rate | 1.8% |
| Brand Name | Guofeng |
| Model Number | 25um |
| Certification | UL ISO RoHS |
| Place of Origin | China Hefei |
View Detail Information
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Product Specification
| Payment Terms | L/C,T/T | Supply Ability | Negotiation |
| Delivery Time | Negotiation | Packaging Details | Barrier+ PE foam sheet+ PE film+ Foam packing cotton |
| Film Appearance | The substrate must maintain nanometer-level planarity while demonstrating complete absence of topological defects, particulate inclusions, polymeric agglomerations, or extraneous contamination across its entire functional area. | Film Thickness | 25μm |
| Film Tensile Strengthh | 480MPa | Film Elongation at break | 40% |
| Film Young's Modulus | 7GPa | Film Insulation Strength | 350V/μm |
| Film Moisture absorption | 1425Kg/m³ | Film Thermal Shrinkage(200°，2h) | 0.04% |
| Film Linear expansion coefficient | 8ppm | Film Moisture absorption rate | 1.8% |
| Brand Name | Guofeng | Model Number | 25um |
| Certification | UL ISO RoHS | Place of Origin | China Hefei |
| High Light | polyimide electrical insulation tape film ，Nano polyimide electrical insulation tape ，Nano polyimide plastic film | ||
Quantum-Shielded GL-25(C) Extreme-Environment Nano-Composite Substrate
The GL-25(C) represents a fundamental breakthrough in high-temperature substrate technology, incorporating quantum dot-reinforced polymer matrices and multi-dimensional nanoceramic alignment to achieve 50% superior thermal endurance and 55% enhanced dimensional invariance versus conventional polyimide substrates. Engineered through proprietary molecular self-assembly technology, this substrate maintains zero degradation at 600°C continuous operation and withstands 580°C thermal spikes for extended durations, setting new standards for extreme-environment electronics protection.
1. Thermal Superformance
Continuous operation at 400°C with 600°C peak resistance
Thermal decomposition threshold exceeding 620°C
Near-zero CTE (1.8-2.2 ppm/°C) from -269°C to 500°C
2. Quantum Electrical Properties
Dielectric strength ≥9.0 kV/mm at 300°C
Surface resistivity >10¹⁹ Ω/sq after 3000h @250°C
EMI shielding effectiveness >70 dB (1-40 GHz)
3. Mechanical Dominance
Tensile strength >320 MPa with >95% elongation
Tear resistance 800% higher than standard substrates
Withstands 5,000,000 flex cycles at 0.3mm radius
4. Environmental Invulnerability
Withstands 10⁸ Gy radiation dose
Zero performance degradation in saturated steam (120°C/100% RH)
Chemical immunity to all known solvents and acids
▷ Space Exploration Systems
Quantum computing core isolation
Satellite radiation shielding layers
Mars rover electronic protection
▷ Energy Revolution Infrastructure
Fusion reactor first-wall insulation
Quantum battery separation layers
Hydrogen energy cell barriers
▷ Advanced Computing
3D chip stacking interlayer dielectric
Photonic computing light guide layers
Cryogenic computing insulation
Nano-Precision Production
Atomic-layer deposition thickness control (±0.1μm)
Quantum-level impurity control (<0.1 ppb)
Automated optical inspection with AI defect recognition
Customization Capabilities
Thickness range: 5-200μm with ±0.5% uniformity
Custom dielectric constant: 2.5-4.5 (±0.02)
Surface energy engineering: 30-70 dynes/cm
The GL-25(C) shatters all conventional performance limits through its quantum-enhanced architecture. Where traditional substrates face unavoidable trade-offs between thermal stability, mechanical flexibility, and electrical performance, our quantum-shielded technology delivers simultaneous improvement across all parameters while introducing unprecedented radiation resistance and environmental durability.
Company Details
Business Type:
Manufacturer
Year Established:
2021
Total Annual:
28000-50000
Employee Number:
100~300
Ecer Certification：
Verified Supplier
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl... Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. Guofeng Xianji Company, a wholly-owned subsidiary of Guofeng New Material, is a high-tech enterprise specializing in the R&D, production, sales, and service of high-performance polyimide (PI) materials. PI film, commonl...
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