Horizontal Wafer Carrier Box 8" 12" Secure Transporter RoHS

Product Specification

Horizontal Wafer Carrier – Precision Handling for Semiconductor Manufacturing

 
The Horizontal Wafer Carrier represents a critical innovation in semiconductor manufacturing, designed to safely transport and store delicate wafers (150mm to 450mm) during fabrication processes. Engineered for cleanroom compatibility and process stability, these carriers utilize advanced materials and precision engineering to minimize particle generation while maximizing wafer throughput in deposition, etching, and inspection equipment.
 
Unlike traditional vertical carriers, horizontal designs provide:
 

• Upper & Lower Cover Inner Ring Design – Minimizes wafer lateral movement while preventing edge contact, ensuring scratch-free handling.

• Reinforced Lower Inner Ring with Finger Grips – Enhances shock resistance and provides compatibility with automated equipment interfaces.

• 4-Point Locking System & Impact-Resistant Outer Ring – Protects wafers during transit with structural robustness.

• Recessed Surface Lettering – Prevents tearing of HDPE packaging bags during logistics.

Key Features of Horizontal Wafer Carrier Box

1. Precision Wafer Stabilization System

Dual-Cover Inner Ring Technology:

• Upper ring: Precision-machined aluminum alloy with PVD ceramic coating

  • 12-point wafer contact system with 0.05mm tolerance

  • Integrated strain gauges for real-time wafer stress monitoring (optional)

• Lower ring: Carbon-fiber reinforced composite

  • 3-zone dampening fingers with adjustable stiffness (5-15N/mm)

  • Automatic thermal compensation for -40°C to 200°C operation

Performance Data:

• Wafer shift <0.1mm at 2.5m/s² acceleration

• Edge exclusion zone reduced to 0.5mm (from typical 2mm)

• 0% wafer breakage in 1 million cycle testing

2. Advanced Shock and Vibration Protection

Multi-Layer Protection Architecture:

1. Primary absorption: Viscoelastic polymer dampeners (15G rating)

2. Secondary buffer: Titanium spring system in base plate

3. Tertiary protection: Impact-resistant polycarbonate buffer zones

Vibration Performance:

• 5x better vibration isolation than previous gen (0.01g transmission at 100Hz)

• Maintains <0.2μm TIR (Total Indicated Runout) during AMHS transport

3. Industrial 4.0 Readiness

Smart Features:

• Integrated IoT sensors (temperature, humidity, vibration)

• Wireless charging for continuous sensor operation

• Predictive maintenance alerts via factory MES integration

Automation Interfaces:

• Standard E84/E87 robotic end effector compatibility

• Tool-free quick release mechanism (<30s latch replacement)

• Auto-alignment guides with ±0.1mm repeatability

4. Cleanroom-Optimized Design

Particle Control:

• All moving parts feature particle traps with >95% capture efficiency

• Ceramic-coated sliding surfaces (<0.01 particles/cm³ generation)

• Periodic purge ports for nitrogen cleaning

Safety Enhancements:

• Laser-etched markings recessed 0.3mm below surface

• All sharp edges radiused to >0.5mm

• Anti-static materials (10⁶-10⁹ Ω/sq surface resistance)

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Application of Horizontal Wafer Carrier Box

1. Front-End Semiconductor Processing

• Thin film deposition (CVD, PVD, ALD)

• Plasma etching/ashing

• Ion implantation

2. Metrology & Inspection

• EUV lithography mask transport

• Wafer inspection tools

• X-ray diffraction analysis

3. Advanced Packaging

• 2.5D/3D IC assembly

• Wafer-level packaging (WLP)

• TSV (Through-Silicon Via) processes

4. Research & Development

• Pilot line wafer handling

• New material development

• Process qualification

Technical Specifications

Q&A

Q1: Why choose horizontal over vertical carriers?
A1: Horizontal orientation recreases wafer deflection by 60% (per SEMI E158-1119), critical for <5nm node processing.
 
Q2: How do you prevent wafer sticking?
A2: Our nano-patterned pocket surfaces reduce contact area by 85% versus standard designs.
 
Q3: What's the maintenance schedule?
A3: 50,000 cycles before pad replacement; full refurbishment every 200k cycles.
 
Q4: How do you handle wafer breakage?
A4: Fragmented wafer containment pockets prevent cross-contamination.
 
Q5: Can carriers be used in vacuum chambers?
A5: Yes - special outgassing-optimized versions available (<10⁻⁶ Torr·L/sec).