Shenzhen Xinchenger Electronic Co.,Ltd
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Base MateriaL | Rogers/Teflon |
| Board Thickness | 1.6mm |
| Min. Line Width | 5um |
| Layer | 1-28 for mass production;up to 40layers for piot run |
| Min. Line Spacing | 0.15mm |
| Brand Name | XCE |
| Model Number | XCEPCB016 |
| Certification | CE,ROHS,FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box | Base MateriaL | Rogers/Teflon |
| Board Thickness | 1.6mm | Min. Line Width | 5um |
| Layer | 1-28 for mass production;up to 40layers for piot run | Min. Line Spacing | 0.15mm |
| Brand Name | XCE | Model Number | XCEPCB016 |
| Certification | CE,ROHS,FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | multi layered pcb ，multilayer pcb fabrication | ||
Item description:
| Material:FR4 | Soldermask:Green |
| Molde Number:xcepcb0016 | Silkscreen:White |
| Layer:16 | Panel Size:300*205mm/5pcs |
| Board Thickness:1.6mm |
Package Details: Inner:Vacuum-packed Bubble bag With Foam Outer:Carton Box |
| Min Line Space:8Mil | |
| Min Line Width:8Mil | |
| Min Hole Size:18Mil | |
| Finished Surface:ENIG |
Special requirement: BGA Prepreg Provide Slice report |
| Finished Copper:1oz | |
|
Delivery Time:8 Days |
Our PCB production capacity
| PCB Item | Manufacture Capacity |
| Layer Counts | 1--28L for mass production, up to 40layers for pilot run |
| Base Material | FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Material Thickness(mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 |
| Max board size(mm) | 1200x400mm |
| Board Outline Tolerance | ±0.15mm |
| Board Thickness | 0.4mm--3.2mm |
| Thickness Tolerance | ±8% |
| Minimum line/space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min Hole Size(mechanical) | 0.2mm |
| Min Hole Size(laser hole) | 0.1mm |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL/LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| Surface Finish | HAL,ENIG,Plated Gold,Immersion Gold,OSP |
| Copper | |
| Copper Weight | 0.5--6oz |
| Color | |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silk screen | White, Black, Blue,Yellow |
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
| Certificate | ROSH,ISO9001,UL |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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