Payment Terms | T/T,Western union |
Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days |
Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Material | Taconic |
Layer | 2 |
Color | Black |
Min line space | 5mil |
Min line width | 5mil |
Copper thickness | 1OZ |
Board size | 200*75mm |
Panel | 1 |
Surface | HASL-LF |
Brand Name | XCE |
Model Number | XCEM |
Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Material | Taconic | Layer | 2 |
Color | Black | Min line space | 5mil |
Min line width | 5mil | Copper thickness | 1OZ |
Board size | 200*75mm | Panel | 1 |
Surface | HASL-LF | Brand Name | XCE |
Model Number | XCEM | Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin | China | ||
High Light | quick turn PCB ,Making Printed Circuit Boards |
High Frequency Taconic PCB Board 0.8mm Thickness In HASL - LF Finished Surface
Quick detail:
Origin:China | Special: High frequency pcb |
Layer:2 | Thickness:0.79mm |
Surface: HASL-LF | Hole:0.8 |
Introduction:
The increasing complexity of electronic components and switches continually requires faster
signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times
in electronic components, it has also become necessary for high frequency (HF) technology to
view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that the
impedance (dynamic resistance) varies with respect to the sending component. To prevent such
capacitive effects, all parameters must be exactly specified, and implemented with the highest level
of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace
geometry,the layer buildup, and the dielectric constant (er) of the materials used.
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
High-frequency circuit board includes a hollow core plate provided with grooves and glue to flow through the upper and lower surfaces of the CCL on the core plate, the upper opening of the hollow groove and a lower opening edge with a wall.
Typical Applications
Taconic Advanced Dielectric branch provides PTFE / woven glass fiber cloth sheet of microwave, radio frequency (RF) and high-speed digital signal processing market. This material can be applied to LNAs, LNBs, PCS / PCN antenna system, global positioning system (GPS) and UMTS antenna system, and a power amplifier, passive components, collision avoidance radar systems, aviation technology and remote assistant director phased array radar system.
Parameter:
o | Item | Data |
1 | Layer: | 1 to 24 layers |
2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
3 | Board thickness: | 0.20mm to 3.4mm |
4 | Copper thickness: | 0.5 OZ to 4 OZ |
5 | Copper thickness in hole: | >25.0 um (>1mil) |
6 | Max. Board Size: | (580mm×1200mm) |
7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
8 | Min. Line Width: | 3mil (0.075mm) |
9 | Min. Line Spacing: | 3mil (0.075mm) |
10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
12 | Shape tolerance: | ±0.13 |
13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
15 | Certificate: | UL,SGS,ISO 9001:2008 |
16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
17 | Profiling: | Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |
Company spirit:Customer first,openness basing on sincerity.
Comapny culture:Improve employees quality with on the job training.
Quality policy:Honesty,superior quality,high efficiency.
Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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