Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Base material | FR4 High frequency material |
| Name | FR4 high frequency pcb |
| Board thickness | 1.2mm |
| Copper THK | 1OZ |
| Board size | 3*2cm |
| Surface finish | Immersion gold |
| Brand Name | XCE |
| Model Number | XCEF |
| Certification | CE,ROHS, FCC,ISO9008 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Base material | FR4 High frequency material | Name | FR4 high frequency pcb |
| Board thickness | 1.2mm | Copper THK | 1OZ |
| Board size | 3*2cm | Surface finish | Immersion gold |
| Brand Name | XCE | Model Number | XCEF |
| Certification | CE,ROHS, FCC,ISO9008 | Place of Origin | China |
| High Light | pcb manufacturing process ，fr4 circuit board | ||
One Stop Turn-Key Service For Fr4 High Frequency PCB Electronic Circuit Boards
Quick detail:
Delivery time: 5-8days
Required files: gerber file
Payment way: T/T,Western Union,Paypal
Specification
|
PCB Type: |
FR4 High frequency pcb |
|
Layer : |
2 layer |
|
Min .Line Width/Space: |
3mil/3mil |
|
Min. Via Diameter: |
0.3mm |
|
Finish Thickness: |
1.2mm |
|
Surface Finish: |
ENIG |
|
Size: |
3*2CM |
|
Material: |
Fr4 high frequency material |
|
Color: |
golden |
|
Application: |
car |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
Description:
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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