Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union, L/C, MoneyGram |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Layer | 2 layer |
| Color | green |
| Material | FR4 |
| Surface | HASL lead free |
| Brand Name | XCE |
| Model Number | XCEF |
| Certification | CE,ROHS, FCC,ISO9008 |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union, L/C, MoneyGram | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Layer | 2 layer | Color | green |
| Material | FR4 | Surface | HASL lead free |
| Brand Name | XCE | Model Number | XCEF |
| Certification | CE,ROHS, FCC,ISO9008 | Place of Origin | China |
| High Light | pcb manufacturing process ，Custom Printed Circuit Board | ||
Turnkey Solar Inverter FR4 PCB Circuit Board With Design Service
Specification:
| Layers:2 | Material:FR4 |
| Board thickness:1.2MM | Copper thickness:1.5OZ |
| Min hole size:8mil | Min line space:8mil |
| Min line width:8mil | Surface:Lead free |
| Solder mask color: green | Certificate:Iso9001,SGS |
Parameter:
| Copper thickness in hole | >25.0 um (>1mil) |
|
Size | Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) | |
| Min. Line Width: 3mil (0.075mm) | |
| Min. Line Spacing: 3mil (0.075mm) | |
|
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
| Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
| Certificate | UL, ISO 9001, ISO 14001 |
| Special requirements | Buried and blind vias+controlled impedance +BGA |
| Profiling | Punching, Routing, V-CUT, Beveling |
| Any other special material please feel free to let us know | |
Description:
Standard products(4, 6 layers), FR4, photo-sensitive soldermask
Special types (thick copper, thin core, hard gold, etc)
High layer count(8-40 layers)
High Density Interconnection (HDI): micro-via technology, build-up construction, laser holes, very small tracks, etc…
Low cost CPTH: polymer conductive holes with copper paste. 4 layers, FR4
Back panels: thick PCBs, press-fit technology, large size PCBs.
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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