Shenzhen Xinchenger Electronic Co.,Ltd
| Payment Terms | T/T,Western union |
| Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days |
| Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Surface finish | OSP |
| Board THK | 1.2mm |
| Product name | high frequency pcb |
| Size | 8*8 |
| Brand Name | XCE |
| Model Number | XCEH |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
| Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
| Surface finish | OSP | Board THK | 1.2mm |
| Product name | high frequency pcb | Size | 8*8 |
| Brand Name | XCE | Model Number | XCEH |
| Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
| High Light | printed circuit board design ，printed circuit board pcb | ||
2 Layer High Frequency Materials PCB For Gate Access System
Specification:
Board size: 8*8 cm
Layer: 2
Model: XCEH
Board thickness: 1.2mm
Copper foil: 35UM
Material: taconic
Description:
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
Parameter:
|
PRODUCT’S DETAILS |
|
|
Raw Material |
taconic |
|
Layer Count |
2-Layer |
|
Board Thickness |
1.2mm |
|
Copper Thickness |
35UM |
|
Surface Finish |
OSP |
|
Solder Mask |
grey |
|
Silkscreen |
White |
|
Min. Trace Width/Spacing |
0.075/0.075mm |
|
Min. Hole Size |
0.25mm |
|
Hole Wall Copper Thickness |
≥20μm |
|
Measurement |
300×400mm |
|
Packaging |
Inner: Vacuum-packed in soft plastic bales |
|
Application |
Communication,automobile,cell,computer,medical |
|
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
|
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
|
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification：
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
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