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China factory - Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

  • China,Foshan ,Guangdong
  • Verified Supplier

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Panel Level Packaging Chip

Manufacturer of a wide range of products which include 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption,LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm,310*320mm Fan-Out Panel Level Packaging...

Quality 310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption for sale

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310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

  1. MOQ: 3000pcs

  2. Price:

  3. Get Best Quote
Payment Terms T/T
Supply Ability stable
Delivery Time 1 month
Brand Name FZX Fanout Process and Product
Model Number Multi-chip MOSFET
Place of Origin PR China

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Quality LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm for sale

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LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

  1. MOQ: 3000pcs

  2. Price:

  3. Get Best Quote
Payment Terms T/T
Supply Ability stable
Delivery Time 1 month
Brand Name FZX Fanout Process and Product
Model Number LED chip(Silicon)
Place of Origin PR China

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Quality 310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip(Silicon) for sale

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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip(Silicon)

  1. MOQ: 3000pcs

  2. Price:

  3. Get Best Quote
Payment Terms T/T
Supply Ability stable
Delivery Time 1 month
Brand Name FZX Fanout Process and Product
Model Number Resistance chip
Place of Origin PR China

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Yes, I am interested!
Quality 310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip(Silicon) for sale

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310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip(Silicon)

  1. MOQ: 3000pcs

  2. Price:

  3. Get Best Quote
Payment Terms T/T
Supply Ability stable
Delivery Time 1 month
Brand Name FZX Fanout Process and Product
Model Number FZX-IC Chip
Place of Origin PR China

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Explore more categories

  1. Panel Level Packaging Form

    Panel Level Packaging Form

    3 products available

  2. Panel Level Packaging Product Structure

    Panel Level Packaging Product Structure

    4 products available

  3. Fan Out Panel Level Packaging

    Fan Out Panel Level Packaging

    5 products available

  4. TGV Through Glass Via

    TGV Through Glass Via

    7 products available

  5. Packaging Simulation Experiments

    Packaging Simulation Experiments

    1 products available

  6. View All Categories

Get in touch with us

  • Reach Us
  • Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
  • Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
  • https://www.fozhixinsmc.com/

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