Payment Terms | T/T, Western Union, Paypal |
Supply Ability | 9000pcs |
Delivery Time | 1 day |
Packaging Details | Please contact me for details |
Description | RF Amplifier IC ISM, PCS, WLL, 802.16/WiMax 50MHz ~ 1.3GHz 05 Plastic Package |
Device Current | 80 mA |
Power Dissipation | 550 mW |
RF Input Power | +13 dBm |
Junction Temperature | 150°C |
Storage Temperature | –65 to 150°C |
Device Voltage Temperature Coefficient | -8.0 mV/°C |
Brand Name | |
Model Number | MSA-1105-TR1 |
Certification | new & original |
Place of Origin | original factory |
View Detail Information
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Product Specification
Payment Terms | T/T, Western Union, Paypal | Supply Ability | 9000pcs |
Delivery Time | 1 day | Packaging Details | Please contact me for details |
Description | RF Amplifier IC ISM, PCS, WLL, 802.16/WiMax 50MHz ~ 1.3GHz 05 Plastic Package | Device Current | 80 mA |
Power Dissipation | 550 mW | RF Input Power | +13 dBm |
Junction Temperature | 150°C | Storage Temperature | –65 to 150°C |
Device Voltage Temperature Coefficient | -8.0 mV/°C | Brand Name | |
Model Number | MSA-1105-TR1 | Certification | new & original |
Place of Origin | original factory | ||
High Light | electronic integrated circuit ,linear integrated circuits |
Cascadable Silicon Bipolar MMIC Amplifier MSA-1105
Features
• High Dynamic Range Cascadable 50 Ω or 75 Ω Gain Block
• 3 dB Bandwidth: 50 MHz to 1.3 GHz
• 17.5 dBm Typical P1 dB at 0.5 GHz
• 3.6 dB Typical Noise Figure at 0.5 GHz
• Surface Mount Plastic Package
• Tape-and-Reel Packaging Option Available[1]
Note: 1. Refer to PACKAGING section “Tapeand-Reel Packaging for Semiconductor Devices.”
Description
The MSA-1105 is a high performance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a low cost, surface mount plastic package. This MMIC is designed for high dynamic range in either 50 or 75␣ Ω systems by combining low noise figure with high IP3. Typical applications include narrow and broadband linear amplifiers in commercial and industrial systems.
The MSA-series is fabricated using HP’s 10 GHz fT, 25 GHz f MAX silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.
Typical Biasing Configuration
05 Plastic Package
MSA-1105 Absolute Maximum Ratings
Parameter | Absolute Maximum[1] |
---|---|
Device Current | 80 mA |
Power Dissipation[2,3] | 550 mW |
RF Input Power | +13 dBm |
Junction Temperature | 150°C |
Storage Temperature | –65 to 150°C |
Thermal Resistance[2,4]: θjc = 125°C/W
Notes:
1. Permanent damage may occur if any of these limits are exceeded.
2. TCASE = 25°C.
3. Derate at 8 mW/°C for TC > 124°C.
4. See MEASUREMENTS section “Thermal Resistance” for more information.
05 Plastic Package Dimensions
Stock Offer (Hot Sell)
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Company Details
Business Type:
Distributor/Wholesaler
Year Established:
2008
Total Annual:
5000000-7000000
Employee Number:
80~100
Ecer Certification:
Active Member
CHONGMING GROUP (HK) INT'L CO., LTD. located in Hong Kong and Shenzhen. We are an independent Distributor of Electronic Components,established in 2008. AS a growing fast company, CM GROUP is renowned for its world-class efficiency, excellent services, and extraordinary ability to supply electron... CHONGMING GROUP (HK) INT'L CO., LTD. located in Hong Kong and Shenzhen. We are an independent Distributor of Electronic Components,established in 2008. AS a growing fast company, CM GROUP is renowned for its world-class efficiency, excellent services, and extraordinary ability to supply electron...
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