Payment Terms | T/T, Paypal |
Supply Ability | 50000pcs |
Delivery Time | 2-10 working days |
Packaging Details | Packing |
Solder Mask | No |
Base Material | RO4003C/Tg170 FR-4 PCB |
Color Of Silkscreen | N/A |
Layer Count | 2 |
Min. Solder Mask Clearance | 0.1mm |
Product Type | Printed Circuit Board |
Surface Finish | HASL |
Payment Method | PayPal, T/T |
Min. Line Width/Spacing | 0.1mm/0.1mm |
Minimum Hole Size | 0.2mm |
Board Type | 2-Layer PCB |
Fiducial Mark | Through hole |
Product Solder Mask | Green, Red, Blue, Black, White, Yellow |
Solder Mask Colour | N/A |
Shipping Method | DHL/FedEx/UPS |
Brand Name | Rogers |
Model Number | RO4003C/Tg170 FR-4 PCB |
Certification | ISO9001 |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T, Paypal | Supply Ability | 50000pcs |
Delivery Time | 2-10 working days | Packaging Details | Packing |
Solder Mask | No | Base Material | RO4003C/Tg170 FR-4 PCB |
Color Of Silkscreen | N/A | Layer Count | 2 |
Min. Solder Mask Clearance | 0.1mm | Product Type | Printed Circuit Board |
Surface Finish | HASL | Payment Method | PayPal, T/T |
Min. Line Width/Spacing | 0.1mm/0.1mm | Minimum Hole Size | 0.2mm |
Board Type | 2-Layer PCB | Fiducial Mark | Through hole |
Product Solder Mask | Green, Red, Blue, Black, White, Yellow | Solder Mask Colour | N/A |
Shipping Method | DHL/FedEx/UPS | Brand Name | Rogers |
Model Number | RO4003C/Tg170 FR-4 PCB | Certification | ISO9001 |
Place of Origin | China |
6-Layer RO4003C/Tg170 FR-4 PCB: 6.8mm Thickness, Immersion Gold Finish, and No Solder Mask
Overview of the 6-Layer RO4003C/Tg170 FR-4 PCB
The 6-Layer RO4003C/Tg170 FR-4 PCB is a highly durable and performance-optimized printed circuit board designed for demanding applications in cellular base stations, automotive radar, and RF systems. This PCB combines Rogers RO4003C and Tg170 FR-4 cores, offering exceptional thermal stability, low dielectric loss, and dimensional reliability. With 6.8mm finished thickness, immersion gold surface finish, and controlled-depth slots, the design ensures long-term reliability and optimal signal performance for high-frequency devices.
This multi-layer PCB is manufactured to IPC-Class-2 standards, ensuring consistent quality and worldwide availability. It's perfect for performance-sensitive, high-volume applications where precise electrical and thermal properties are critical.
PCB Construction Details
The 6-layer rigid PCB is built with a mix of RO4003C high-frequency laminate and Tg170 FR-4, providing a blend of high thermal conductivity and cost-effective manufacturability. Below is a detailed table of its construction specifications:
Parameter | Specification |
Base Material | RO4003C / Tg170 FR-4 |
Layer Count | 6 Layers |
Board Dimensions | 495mm x 345mm ± 0.15mm |
Minimum Trace/Space | 5/6 mils |
Minimum Hole Size | 0.8mm |
Blind Vias | No |
Finished Thickness | 6.8mm |
Copper Weight | 1oz (1.4 mils) outer & inner layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Gold |
Top Silkscreen | No |
Bottom Silkscreen | No |
Top Solder Mask | No |
Bottom Solder Mask | No |
Depth-Controlled Slots | Top and Bottom Layers |
Electrical Testing | 100% tested prior to shipment |
PCB Stackup
The stackup for this 6-layer rigid PCB alternates between high-performance RO4003C and cost-efficient Tg170 FR-4, ensuring thermal stability and dielectric uniformity. The detailed layer structure is as follows:
Layer | Material | Thickness |
Copper Layer 1 | Copper (1oz) | 35 μm |
Core Material | Tg170 FR-4 Core | 3.0mm |
Copper Layer 2 | Copper (1oz) | 35 μm |
Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
Copper Layer 3 | Copper (1oz) | 35 μm |
Core Material | Rogers RO4003C Core | 0.305mm |
Copper Layer 4 | Copper (1oz) | 35 μm |
Bonding Ply | Epoxy Resin (4mil) | 0.102mm |
Copper Layer 5 | Copper (1oz) | 35 μm |
Core Material | Tg170 FR-4 Core | 3.0mm |
Copper Layer 6 | Copper (1oz) | 35 μm |
PCB Statistics
The 6-layer RO4003C/Tg170 FR-4 PCB is optimized for high-density component placement and reliable signal routing. Below are its key statistics:
Introduction to RO4003C
The Rogers RO4003C laminate is a woven glass-reinforced hydrocarbon/ceramic material that offers the electrical performance of PTFE but with the manufacturability of epoxy-glass laminates. Its low dielectric constant (Dk) of 3.38 ± 0.05 and dissipation factor of 0.0027 at 10GHz make it ideal for high-frequency applications.
Key features of RO4003C include:
Applications
This PCB is ideal for applications requiring high-frequency stability and reliability, such as:
With its 6-layer construction, RO4003C core, and immersion gold finish, the 6-layer RO4003C/Tg170 FR-4 PCB is the perfect choice for demanding RF and microwave systems. Its combination of durability, performance, and cost-efficiency makes it a standout solution for high-volume, performance-critical applications.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Site Member
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
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