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{"title":"TLX-0 2-layer rigid PCB Built On PTFE fiberglass composites with Immersion Gold","imgUrl":"https:\/\/img.ismap.com\/nimg\/c0\/19\/a659a9f1399b264a9b3b85310258-200x200-1\/tlx_0_2_layer_rigid_pcb_built_on_ptfe_fiberglass_composites_with_immersion_gold_rf_microwave_substrate.jpg","attrs":{"Brand Name":"Bicheng Enterprise","Model Number":"BIC-0260-V2.60","Certification":"UL","Place of Origin":"China"}}
{"title":"Rogers RO3010 High frequency PCB : ceramic-filled PTFE composite circuit","imgUrl":"https:\/\/img.ismap.com\/nimg\/54\/ff\/462cb7235bbf33a4f096cc045473-200x200-1\/rogers_ro3010_high_frequency_pcb_3a_ceramic_filled_ptfe_composite_circuit_material.jpg","attrs":{"Brand Name":"Bicheng Enterprise","Model Number":"BIC-0261-V2.61","Certification":"UL","Place of Origin":"China"}}
{"title":"F4BM220 - A High-Performance Laminate for Demanding RF Applications","imgUrl":"https:\/\/img.ismap.com\/nimg\/6f\/ba\/1158b0831aea64ee14f0eea5d7c9-200x200-1\/f4bm220_a_high_performance_laminate_for_demanding_rf_applications.jpg","attrs":{"Brand Name":"Bicheng Enterprise","Model Number":"BIC-0265-V2.65","Certification":"UL","Place of Origin":"China"}}
Introduction The RT/duroid 6035HTC PCB is a cutting-edge solution crafted from advanced Rogers RT/duroid 6035HTC high-frequency circuit materials. This PCB sets a new standard in performance and reliability for high-power RF and microwave applications.
Key Features and Benefits
Dielectric constant (DK) of 3.5 +/- 0.05 at 10 GHz/23°C for precise signal transmission
Ultra-low dissipation factor of 0.0013 at 10 GHz/23°C minimizes signal loss
Thermal Coefficient of dielectric constant of -66 ppm/°C ensures stable performance across temperature variations
Moisture absorption rate of 0.06% enhances durability
Impressive thermal conductivity of 1.44 W/m/K at 80°C facilitates efficient heat dissipation
Coefficient of Thermal Expansion (CTE) values provide dimensional stability
Construction and Design Details The RT/duroid 6035HTC PCB features a 2-layer rigid design with Copper Layer 1 and Copper Layer 2 each measuring 35 μm. The RT/duroid 6035HTC core of 0.254 mm (10mil) ensures high performance. The board dimensions of 54mm x 76 mm accommodate versatile applications.
Specifications
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2mm
Finished board thickness: 0.3mm
Finished Cu weight: 1oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Silver
Top Silkscreen: White
Top Solder Mask: Green
100% Electrical test conducted before shipment
Additional Information The RT/duroid 6035HTC PCB includes 11 components, 40 pads, 23 thru-hole pads, and 17 top SMT pads. It also features 18 vias and 2 nets, ensuring seamless signal routing and connectivity for various applications.
Applications Ideal for high-power RF and microwave applications such as amplifiers, couplers, filters, and power dividers, the RT/duroid 6035HTC PCB offers unmatched performance, reliability, and efficiency.
Contact Information For technical inquiries and expert guidance on integrating the RT/duroid 6035HTC PCB into your projects, contact Sally at sales30@bichengpcb.com. Elevate your high-power RF and microwave applications with the precision and performance of the RT/duroid 6035HTC PCB.
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millimeter wave equipm...